With Advanced Materials Solutions at CIPS 2026
CLINTON, N.Y., February 26, 2026 — As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at CIPS – International Conference on Integrated Power Electronics Systems, March 10-12, in Dresden, Germany.
Company products to be highlighted include the following:
- Formic Acid Soldering Technology (FAST) is an ideal reflow method for power device packaging. Product offerings, including preforms, InFORMS®, and novel solder pastes, enable high-reliability, flux-free soldering that is ideal for efficient manufacturing of next-generation power electronics.
- Durafuse® HT is an innovative high-temperature lead-free paste that is ideal for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than those of a high-Pb solder.
- InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
- Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow-processing temperatures compared with SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
- InFORCE® pressure sinter pastes are high-metal, low-organic content sinter materials available in both silver and copper. Its low-organic content composition affords short drying times for increased throughput and less volume reduction between wet and post-sintered deposits, reducing the paste amount required.
To learn more about Indium Corporation’s power electronics and solder solutions, visit www.indium.com or meet with our experts at CIPS booth #5.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
