As energy consumption has become increasingly important—in terms of cost, availability, and environmental impact—it is about time we use quantitative data to consider carbon emissions and oven energy consumption to make process decisions.
Managing ΔT during reflow is an important part of a well controlled process. Durafuse™ LT provides the extra flexibility for process control and reliabilty on large boards.
Shielding the RF waves generated by an MRI machine is mandatory. Soldered copper is one the metals used for RF shielding because it absorbs radio and other electromagnetic waves and easily conforms to any odd angles, while not requiring much maintenance.
Laser soldering is making its way into the market and onto electronics assembly lines. What's the difference between this method and iron-tip robotic soldering? Read to find out.
Cardiac pacemakers generally use 99.99% Au preforms as the solder material in the assembly. Pure gold is highly pure, inert, biocompatible, has a high resistance to corrosion, and works excellently to provide a hermetic seal in the device. All of these properties provide the perfect solder material required for the high quality and performance needed for implantable medical devices.
As a leader in soldering technology, Indium Corporation offers a number of solder pastes for Pb-free assembly. We offer many different alloy choices and flux technologies to solve many of your process challenges.
Indium Corporation’s Pb-free solder pastes are ideal for miniaturized components and fine-pitch assembly. They provide first-class printing and robust reflow performance and are all designed to AVOID THE VOID®.
A halogen-free SAC solder paste with excellent resistance to head-in-pillow (HIP) and non-wet opens (NWO) and unprecedented stencil print transfer efficiency
A halogen-free SAC solder paste designed for maximum print transfer efficiency and elimination of flux spattering
As a leader in soldering technology, Indium Corporation has a variety of tried and true solder pastes for Pb-free circuit board assembly. Here are some additional solder pastes designed to help you with many of your soldering challenges.
Looking for an SMT Solder Paste that has Superior Printing and Voiding Performance?
Want enhanced electrical reliability to ensure your product life reliability?
Need it to be stable for room temperature storage and have a long stencil life?
We have your solution!
Indium8.9HF is a no-clean, halogen-free solder paste that delivers versatility and stability in the printing process. Under optimal process conditions, Indium8.9HF:
Delivers excellent response-to-pause even after being left on the stencil for 60 hours
Avoid the Void® Plus Exceptional In-Circuit Testing Performance with Indium8.9HF1
Indium8.9HF1 is specifically formulated to deliver outstanding voiding performance for bottom-terminated components (BTC) - plus a soft pliable flux residue post reflow, provides unprecedented in-circuit testing (ICT) and flying-probe testing first pass yields.
Enhanced ICT Performance:
Indium8.9HF1 is a Pb-free, no-clean solder paste intended for both air and nitrogen reflow that produces:
Fewer false testing failures which equates to faster cycle times and less rework
Highest first-pass yields in ICT
Soft post-reflow flux residue
Other Features:
Halogen-free per EN14582 test method
Outstanding BTC voiding minimization performance
High oxidation barrier eliminates graping and HiP defects
Provides a molten solder oxidation barrier that prevents further oxidation during reflow and Improves coalescence of small deposits
Indium8.9HFA Solder Paste Delivers Superior Printing for Miniaturization
Leading Print Performance on Miniaturized Components
Indium8.9HFA is a versatile, halogen-free, Pb-free solder paste with leading print performance on miniaturized components.
Print performance is especially critical for manufacturers of mobile phones and other personal electronics devices, especially as they struggle with <8mil challenges associated with continuing miniaturization in the electronics assembly industry.
Indium8.9HFA Solder Paste provides:
Low Cost of Ownership & High Print Yields
Unsurpassed transfer efficiency for consistent, full volume print deposits (8 mil), results in reduced frequency of insufficients and high first-pass print yields
Low print pressure and excellent response-to-pause saves time and money on stencils and line changes
Solvent-free dry-wiping reduces costs
Increased throughput
Higher print speed and reduced wipe frequency enables short cycle time, high up-time, and high throughput printing
Indium8.9HFA works best in applications that require:
Fine feature printing that present challenges for yields (area ratios <0.66); this includes most personal electronics applications
High speed printing applications (>100mm/second or >4 inches/second)
Indium10.1 Solder Paste Best All-around Halogen-containing Paste
Leading Print Performance on Miniaturized Components
Indium Corporation’s Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
The oxidation-inhibiting properties of Indium10.1 solder pastes promote industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 solder paste makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.
Indium10.1 solder paste enables the lowest cost of ownership to PCB assembly manufacturers through an all-around balanced performance in both high print and soldering yields. It boasts a versatile, well-balanced set of properties with best-in-class printing and soldering performance. Indium10.1 solder paste provides industry-leading print definition and transfer efficiency, low voiding performance, and head-in-pillow and graping resistance.
Indium10.1 works best in applications that require:
Wetting performance on difficult to solder or oxidized metallizations
Indium10.8HF solder paste enables low cost-of-ownership to PCB assembly customers through an all-around balanced performance, including stencil printing yields, voiding, and soldering yields.
Indium10.8HF is versatile, with a balanced set of properties:
Meets leading OEM standards for
non-wet open resistance
Oxidation barrier technology delivers strong resistance to:
Head-in-pillow defects
Graping (non-coalescence of powder particles)
Strong surface oxide cleaning and pad wetting during reflow ramp
Low voiding on BGSs, CSPs, and QFNs
Outstanding printing performance with high transfer efficiency and low variability
Excellent response-to-pause
Indium10.8HF works best in applications that require:
Warpage induced defect elimination; such as non-wet open and HIP. These are typically BGA microprocessors with thin core substrates and high IO counts that are found in PCs and tablets.
