Blogue

Arquivo

Pros and Cons of Convection Reflow Soldering using Nitrogen

Any electronics manufacturer who has ever considered implementing nitrogen in their soldering process will tell you that the immediate and largest obstacle is cost. One has to either buy nitrogen

Apoio

To Minimize BTC Voiding, Start with the Right Solder Paste

Let’s see what’s up with Patty….. Patty was just dropped off at O’Hare airport after finishing a 3 day workshop on Lean Six Sigma statistics, design of experiments, and statistical process

Produtos

80Au20Sn: Propriedades físicas superiores

In my previous post we saw that 80Au/20Sn eutectic alloy performs as both a solder or a braze. This is due to its unique and valuable properties. Let’s explore those properties a bit more

Produtos

AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Solder Paste

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa diagram. This tool helps map out a process and provide an

Produtos

Gestão térmica: Por que razão o índio é a melhor escolha

In our first review of our Heat-Spring® metal thermal interface material product line, we noted that the Heat-Spring® sprang from customer need. Polymers and greases were not good enough for

Arquivo

80Au/20Sn – solder or braze? Excellent question.

You may have heard the 80% gold 20% tin alloy referred to as a solder. Or, you may have heard it called a braze. I’m going to explain how both statements are correct. As we all know, solders

Produtos

BGA Voiding in Electronics Assembly

Patty had to admit that the last few weeks were exciting. Her talk to US Army Rangers and Navy Seals on critical thinking went really well. Now, the local newspaper was asking her to comment on

Produtos

Voiding: A Critical Issue in Electronics Assembly

Folks, Looks like Patty and the teamhave a new assignment from Mike Madigan. Let's look in….. Patty had just waved to her twin boys as they got on the school bus when her mobile phone rang.

Arquivo

AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Stencil Design

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provides an

Arquivo

AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Surface Finish

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provides an

Produtos

AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Environment

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an

Produtos

How rare is indium — and are we running out?

You've seen this in the news before: We are running out of resources. Oil (a perennial favorite), indium (for many years now), or (as of November 2014), chocolate. Name your resource and you can

Produtos

Thermal Management Using Indium Metal: The Heat-Spring®

Indium metal has long been used for a variety of applications including low-temperature solder, cryogenic sealing, coatings for touch screens, and in fusible alloys. Most recently it has found its

Produtos

In SMT Statistical Process Control, Cpk is King

Let’s look in on Patty and the team…… Several weeks ago… It was just before Christmas and Patty was heading in to Ivy U from her home in Woodstock, VT. Just as she passed

Apoio

EVITAR O VAZIO®: Grande Vazamento do Plano de Terra na Montagem de Eletrónica: Diagrama de Ishikawa

Está a sofrer de defeitos de soldadura? Precisa de ajuda com o seu processo de montagem de eletrónica SMT? Existe uma ferramenta para isso. As ferramentas estatísticas, como o Diagrama de Ishikawa, ajudam a mapear um processo e fornecem uma

Produtos

Metal Loading in Solder Paste – A Review (Part 1)

As mentioned in an earlier blog post , a solder paste's alloy type, powder particle size distribution (PSD), and metal loading (weight of metal as a percent or "%w/w") affect the

Apoio

Conclusion of In Electronics Manufacturing, Does Cpk =1 Yield 66,800 defects per million?

Patty, Rob, and Pete were quite sure they understood the confusion in the Cpk = 1 issue, but wanted to make sure they discussed it with the Professor. After a brief chat with him, they called ACME

Apoio

Materials Lifetimes – A Modest Proposal

Traveling in Malaysia recently, I met up with an old friend (and customer). We got talking about “lifetime” of solder paste: how long could the material survive various process steps

Produtos

No fabrico de produtos electrónicos, Cpk =1 produz 66 800 defeitos por milhão?

Pessoal, quando a Patty estava a passar pelo gabinete do Professor, a caminho de ver o Pete e o Rob, decidiu passar por lá. "Professor, recebi um telefonema muito estranho... um homem disse que tinha

Arquivo

Wave Soldering: The Soldering Station – An Introduction

For those of you reading my blog for the first time, you will see that my main focus is on Wave Soldering. I recently completed a series on “preheating” where I talked about the different

Produtos

Use the Coffin-Manson Equation to Calculate Number of Thermal Cycles

Folks, Let's look in on Patty and friends…. Patty, Rob, and Pete were headed to their regular monthly meeting where they, along with the Professor, discussed a book they were all reading.

Na Indium, investigamos, desenvolvemos e fabricamos soluções avançadas de materiais de montagem de eletrónica para os desafios de hoje, de amanhã e do futuro.