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ボイディングと同様、ミックスド・テクノロジーを使用する場合は、良いソルダーペーストから始めること。

パティがオフィスに向かって歩いていると、ウルフ・ガブリエルソン教授が通りかかった。「印象的な年配の男性だ。彼は数十年前、ノーベル賞の候補者だった。

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PC、タブレット、携帯電話は滅びない。

皆さん、パティとロブがまた冒険に出たようです。ちょっと覗いてみよう......。パティは大学時代から同じ2001年式のサーブ・ステーションワゴンに乗っていた。それは素晴らしい車だった。

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AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Design

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an

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AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Reflow Profile

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an

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History and Applications of Indium Metal

Phil Zarrow: This video is for researchers and engineers interested in indium metal. It will cover the applications and future uses. Ron, can you tell us a little bit about the history of indium

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Nano-Ag Sintering Paste

Phil Zarrow: This video is for anyone wondering about working with silver sintering materials. It will cover the roles of porosity and pressure. Dr. Lee, why work with silver sintering materials?

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Using Solder Preforms to Reduce Voiding in BTCs

Folks, Let's see how Patty and the team are doing on their presentation on voiding for Mike Madigan … Patty was kind of down. Like millions of others, she and Rob watched, in horror, as

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The 6 Alloy Families: Bismuth

Eric Bastow: Today we're going to be talking about this really unique metal called bismuth. One of the unique things about bismuth metal is, unlike other metals that contract when they solidify,

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The 6 Alloy Families: Gallium

Eric Bastow: Today we're going to be talking about this really cool metal called gallium. It's very unique, because it has a low melting point, and melts at 30 degrees C or 86 degrees

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The 6 Alloy Families: Gold

Eric Bastow: Gold is very useful as a soldering material when it's used with alloys. They have very high melting points, and, for that reason, sometimes the gold-based alloys are referred to as

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The 6 Alloy Families: Lead

Eric Bastow:Today, we're going to be talking about a heavy metal – not heavy metal the kind of music, but a heavy metal – lead. Lead has a very high melting point of 327 degrees

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The 6 Alloy Families: Tin

Eric Bastow: Tin is a very useful metal, very shiny metal, and it melts at 232 degrees C, which is 450 degrees Fahrenheit. It is very useful, because it has a long and wide history for use in

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6つの合金ファミリーインジウム - パート2

エリック・バストウインジウムは非常に用途の広い金属です。ビスマス、スズ、鉛といった他のものと容易に合金になり、広いスペクトルと広い融点を持つ。

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How to Properly Use Cp and Cpk in SMT Assembly

Phil Zarrow: This video is for those in the electronics assembly industry that want to establish when to properly use Cp and Cpk. It includes statistical data and examples. Dr. Lasky, an important

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Minimizing the Head-in-Pillow Defect in SMT Assembly

Phil Zarrow: This video is for those in the electronics assembly industry that want to minimize the head-in-pillow defect. It includes the solder paste properties that help overcome this challenge.

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Assessing Field Reliability and Defect Rates in Electronics Assembly

This is video is for electronics assemblers who are required to assess field reliability. It includes determining whether or not sampling can prove that there are zero defects. Phil Zarrow:

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SMT Wave Soldering: WaveCoach® Helps Optimize Profiling

This video is for electronics assembly professionals who are looking to improve their wave soldering processes. It includes tools and resources that will help overcome common challenges. Phil Zarrow:

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Pros and Cons of Convection Reflow Soldering using Nitrogen

Any electronics manufacturer who has ever considered implementing nitrogen in their soldering process will tell you that the immediate and largest obstacle is cost. One has to either buy nitrogen

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To Minimize BTC Voiding, Start with the Right Solder Paste

Let’s see what’s up with Patty….. Patty was just dropped off at O’Hare airport after finishing a 3 day workshop on Lean Six Sigma statistics, design of experiments, and statistical process

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80Au20Sn:優れた物理的特性

In my previous post we saw that 80Au/20Sn eutectic alloy performs as both a solder or a braze. This is due to its unique and valuable properties. Let’s explore those properties a bit more

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AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Solder Paste

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa diagram. This tool helps map out a process and provide an

インジウムでは、今日、明日、そして未来の課題に対する高度なエレクトロニクス組立材料のソリューションを研究、開発、製造しています。