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Pros and Cons of Convection Reflow Soldering using Nitrogen
Any electronics manufacturer who has ever considered implementing nitrogen in their soldering process will tell you that the immediate and largest obstacle is cost. One has to either buy nitrogen
To Minimize BTC Voiding, Start with the Right Solder Paste
Let’s see what’s up with Patty….. Patty was just dropped off at O’Hare airport after finishing a 3 day workshop on Lean Six Sigma statistics, design of experiments, and statistical process
80Au20Sn:優れた物理的特性
In my previous post we saw that 80Au/20Sn eutectic alloy performs as both a solder or a braze. This is due to its unique and valuable properties. Let’s explore those properties a bit more
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Solder Paste
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa diagram. This tool helps map out a process and provide an
Thermal Management: Why Indium is the Best Choice
In our first review of our Heat-Spring® metal thermal interface material product line, we noted that the Heat-Spring® sprang from customer need. Polymers and greases were not good enough for
80Au/20Sn – solder or braze? Excellent question.
You may have heard the 80% gold 20% tin alloy referred to as a solder. Or, you may have heard it called a braze. I’m going to explain how both statements are correct. As we all know, solders
BGA Voiding in Electronics Assembly
Patty had to admit that the last few weeks were exciting. Her talk to US Army Rangers and Navy Seals on critical thinking went really well. Now, the local newspaper was asking her to comment on
Voiding: A Critical Issue in Electronics Assembly
Folks, Looks like Patty and the teamhave a new assignment from Mike Madigan. Let's look in….. Patty had just waved to her twin boys as they got on the school bus when her mobile phone rang.
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Stencil Design
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provides an
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Surface Finish
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provides an
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Environment
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an
How rare is indium — and are we running out?
You've seen this in the news before: We are running out of resources. Oil (a perennial favorite), indium (for many years now), or (as of November 2014), chocolate. Name your resource and you can
Thermal Management Using Indium Metal: The Heat-Spring®
Indium metal has long been used for a variety of applications including low-temperature solder, cryogenic sealing, coatings for touch screens, and in fusible alloys. Most recently it has found its
In SMT Statistical Process Control, Cpk is King
Let’s look in on Patty and the team…… Several weeks ago… It was just before Christmas and Patty was heading in to Ivy U from her home in Woodstock, VT. Just as she passed
ボイドを避ける電子機器組み立てにおける大きなグランドプレーンボイド:石川ダイアグラム
はんだ付け不良にお困りですか?SMTエレクトロニクス組立工程でお困りですか?そのためのツールがあります。石川ダイアグラムのような統計的ツールは、工程をマッピングし、その工程がどのようなものであるかを示すのに役立ちます。
Metal Loading in Solder Paste – A Review (Part 1)
As mentioned in an earlier blog post , a solder paste's alloy type, powder particle size distribution (PSD), and metal loading (weight of metal as a percent or "%w/w") affect the
Conclusion of In Electronics Manufacturing, Does Cpk =1 Yield 66,800 defects per million?
Patty, Rob, and Pete were quite sure they understood the confusion in the Cpk = 1 issue, but wanted to make sure they discussed it with the Professor. After a brief chat with him, they called ACME
Materials Lifetimes – A Modest Proposal
Traveling in Malaysia recently, I met up with an old friend (and customer). We got talking about “lifetime” of solder paste: how long could the material survive various process steps
エレクトロニクス製造において、Cpk =1は66,800個/100万個の不良品を生み出すか?
皆さん、パティがピートとロブに会いに行く途中、教授のオフィスの前を通りかかったので、立ち寄ってみることにしました。「教授、変な電話がかかってきました。
Wave Soldering: The Soldering Station – An Introduction
For those of you reading my blog for the first time, you will see that my main focus is on Wave Soldering. I recently completed a series on “preheating” where I talked about the different
Use the Coffin-Manson Equation to Calculate Number of Thermal Cycles
Folks, Let's look in on Patty and friends…. Patty, Rob, and Pete were headed to their regular monthly meeting where they, along with the Professor, discussed a book they were all reading.
お困りですか?
インジウムでは、今日、明日、そして未来の課題に対する高度なエレクトロニクス組立材料のソリューションを研究、開発、製造しています。

