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Pros and Cons of Convection Reflow Soldering using Nitrogen
Any electronics manufacturer who has ever considered implementing nitrogen in their soldering process will tell you that the immediate and largest obstacle is cost. One has to either buy nitrogen
To Minimize BTC Voiding, Start with the Right Solder Paste
Let’s see what’s up with Patty….. Patty was just dropped off at O’Hare airport after finishing a 3 day workshop on Lean Six Sigma statistics, design of experiments, and statistical process
80Au20Sn : Propriétés physiques supérieures
In my previous post we saw that 80Au/20Sn eutectic alloy performs as both a solder or a braze. This is due to its unique and valuable properties. Let’s explore those properties a bit more
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Solder Paste
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa diagram. This tool helps map out a process and provide an
Thermal Management: Why Indium is the Best Choice
In our first review of our Heat-Spring® metal thermal interface material product line, we noted that the Heat-Spring® sprang from customer need. Polymers and greases were not good enough for
80Au/20Sn - souder ou braser ? Excellente question.
You may have heard the 80% gold 20% tin alloy referred to as a solder. Or, you may have heard it called a braze. I’m going to explain how both statements are correct. As we all know, solders
BGA Voiding in Electronics Assembly
Patty had to admit that the last few weeks were exciting. Her talk to US Army Rangers and Navy Seals on critical thinking went really well. Now, the local newspaper was asking her to comment on
Voiding: A Critical Issue in Electronics Assembly
Folks, Looks like Patty and the teamhave a new assignment from Mike Madigan. Let's look in….. Patty had just waved to her twin boys as they got on the school bus when her mobile phone rang.
ÉVITER LE VIDE® : Le grand vide du plan de masse dans l'assemblage électronique : Conception de pochoirs
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provides an
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Surface Finish
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provides an
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Environment
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an
Quelle est la rareté de l'indium et sommes-nous en train d'en manquer ?
You've seen this in the news before: We are running out of resources. Oil (a perennial favorite), indium (for many years now), or (as of November 2014), chocolate. Name your resource and you can
Thermal Management Using Indium Metal: The Heat-Spring®
Indium metal has long been used for a variety of applications including low-temperature solder, cryogenic sealing, coatings for touch screens, and in fusible alloys. Most recently it has found its
Dans le contrôle statistique des processus SMT, le Cpk est roi
Let’s look in on Patty and the team…… Several weeks ago… It was just before Christmas and Patty was heading in to Ivy U from her home in Woodstock, VT. Just as she passed
ÉVITER LE VIDE® : Les grands vides du plan de masse dans l'assemblage électronique : Diagramme d'Ishikawa
Vous rencontrez des défauts de soudure ? Vous avez besoin d'aide pour votre processus d'assemblage électronique SMT ? Il existe un outil pour cela. Les outils statistiques, tels que le diagramme d'Ishikawa, permettent de schématiser un processus et de fournir un aperçu de son évolution.
Metal Loading in Solder Paste – A Review (Part 1)
As mentioned in an earlier blog post , a solder paste's alloy type, powder particle size distribution (PSD), and metal loading (weight of metal as a percent or "%w/w") affect the
Conclusion of In Electronics Manufacturing, Does Cpk =1 Yield 66,800 defects per million?
Patty, Rob, and Pete were quite sure they understood the confusion in the Cpk = 1 issue, but wanted to make sure they discussed it with the Professor. After a brief chat with him, they called ACME
Materials Lifetimes – A Modest Proposal
Traveling in Malaysia recently, I met up with an old friend (and customer). We got talking about “lifetime” of solder paste: how long could the material survive various process steps
Dans la fabrication de produits électroniques, est-ce que Cpk =1 permet d'obtenir 66 800 défauts par million ?
Alors que Patty passait devant le bureau du professeur en allant voir Pete et Rob, elle a décidé d'y faire un saut. "Professeur, j'ai reçu un appel téléphonique des plus étranges... un homme a prétendu qu'il avait
Wave Soldering: The Soldering Station – An Introduction
For those of you reading my blog for the first time, you will see that my main focus is on Wave Soldering. I recently completed a series on “preheating” where I talked about the different
Utiliser l'équation de Coffin-Manson pour calculer le nombre de cycles thermiques
Folks, Let's look in on Patty and friends…. Patty, Rob, and Pete were headed to their regular monthly meeting where they, along with the Professor, discussed a book they were all reading.
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Chez Indium, nous recherchons, développons et fabriquons des matériaux d'assemblage électroniques avancés pour répondre aux défis d'aujourd'hui, de demain et de l'avenir.

