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與空洞化一樣,當使用混合技術時,請先使用良好的焊膏
Patty 正往她的辦公室走,看到 Ulf Gabrielson 教授經過。"她心想:「這位老先生真是令人印象深刻。幾十年前,他曾是諾貝爾獎的競賽者。
個人電腦、平板電腦和行動電話不會消亡,並將繼續帶來虛擬化的挑戰
各位,看來 Patty 和 Rob 又要去冒險了。讓我們看看.....Patty 從大學開始就開著同一輛 2001 年的 Saab 旅行車。它曾經是一輛很棒的車,但是,隨著幾乎
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Design
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Reflow Profile
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an
Nano-Ag Sintering Paste
Phil Zarrow: This video is for anyone wondering about working with silver sintering materials. It will cover the roles of porosity and pressure. Dr. Lee, why work with silver sintering materials?
Using Solder Preforms to Reduce Voiding in BTCs
Folks, Let's see how Patty and the team are doing on their presentation on voiding for Mike Madigan … Patty was kind of down. Like millions of others, she and Rob watched, in horror, as
The 6 Alloy Families: Bismuth
Eric Bastow: Today we're going to be talking about this really unique metal called bismuth. One of the unique things about bismuth metal is, unlike other metals that contract when they solidify,
The 6 Alloy Families: Gallium
Eric Bastow: Today we're going to be talking about this really cool metal called gallium. It's very unique, because it has a low melting point, and melts at 30 degrees C or 86 degrees
The 6 Alloy Families: Lead
Eric Bastow:Today, we're going to be talking about a heavy metal – not heavy metal the kind of music, but a heavy metal – lead. Lead has a very high melting point of 327 degrees
The 6 Alloy Families: Tin
Eric Bastow: Tin is a very useful metal, very shiny metal, and it melts at 232 degrees C, which is 450 degrees Fahrenheit. It is very useful, because it has a long and wide history for use in
How to Properly Use Cp and Cpk in SMT Assembly
Phil Zarrow: This video is for those in the electronics assembly industry that want to establish when to properly use Cp and Cpk. It includes statistical data and examples. Dr. Lasky, an important
Minimizing the Head-in-Pillow Defect in SMT Assembly
Phil Zarrow: This video is for those in the electronics assembly industry that want to minimize the head-in-pillow defect. It includes the solder paste properties that help overcome this challenge.
Assessing Field Reliability and Defect Rates in Electronics Assembly
This is video is for electronics assemblers who are required to assess field reliability. It includes determining whether or not sampling can prove that there are zero defects. Phil Zarrow:
SMT Wave Soldering: WaveCoach® Helps Optimize Profiling
This video is for electronics assembly professionals who are looking to improve their wave soldering processes. It includes tools and resources that will help overcome common challenges. Phil Zarrow:
Pros and Cons of Convection Reflow Soldering using Nitrogen
Any electronics manufacturer who has ever considered implementing nitrogen in their soldering process will tell you that the immediate and largest obstacle is cost. One has to either buy nitrogen
To Minimize BTC Voiding, Start with the Right Solder Paste
Let’s see what’s up with Patty….. Patty was just dropped off at O’Hare airport after finishing a 3 day workshop on Lean Six Sigma statistics, design of experiments, and statistical process
80Au20Sn: Superior Physical Properties
In my previous post we saw that 80Au/20Sn eutectic alloy performs as both a solder or a braze. This is due to its unique and valuable properties. Let’s explore those properties a bit more
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Solder Paste
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa diagram. This tool helps map out a process and provide an
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在 Indium,我們研究、開發並製造先進的電子組裝材料解決方案,以因應今日、明日及未來的挑戰。

