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Pros and Cons of Convection Reflow Soldering using Nitrogen

Any electronics manufacturer who has ever considered implementing nitrogen in their soldering process will tell you that the immediate and largest obstacle is cost. One has to either buy nitrogen

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To Minimize BTC Voiding, Start with the Right Solder Paste

Let’s see what’s up with Patty….. Patty was just dropped off at O’Hare airport after finishing a 3 day workshop on Lean Six Sigma statistics, design of experiments, and statistical process

Prodotti

80Au20Sn: Proprietà fisiche superiori

In my previous post we saw that 80Au/20Sn eutectic alloy performs as both a solder or a braze. This is due to its unique and valuable properties. Let’s explore those properties a bit more

Prodotti

EVITARE IL VUOTO®: Vuoto del piano di massa di grandi dimensioni nell'assemblaggio di componenti elettronici: Pasta saldante

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa diagram. This tool helps map out a process and provide an

Prodotti

Thermal Management: Why Indium is the Best Choice

In our first review of our Heat-Spring® metal thermal interface material product line, we noted that the Heat-Spring® sprang from customer need. Polymers and greases were not good enough for

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80Au/20Sn – solder or braze? Excellent question.

You may have heard the 80% gold 20% tin alloy referred to as a solder. Or, you may have heard it called a braze. I’m going to explain how both statements are correct. As we all know, solders

Prodotti

BGA Voiding in Electronics Assembly

Patty had to admit that the last few weeks were exciting. Her talk to US Army Rangers and Navy Seals on critical thinking went really well. Now, the local newspaper was asking her to comment on

Prodotti

Voiding: A Critical Issue in Electronics Assembly

Folks, Looks like Patty and the teamhave a new assignment from Mike Madigan. Let's look in….. Patty had just waved to her twin boys as they got on the school bus when her mobile phone rang.

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AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Stencil Design

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provides an

Archivio

EVITARE IL VUOTO®: Vuoto del piano di massa di grandi dimensioni nell'assemblaggio di componenti elettronici: Finitura superficiale del PWB

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provides an

Prodotti

AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Environment

In un post precedente ho parlato del fenomeno del “Large Ground Plane Voiding” nell’assemblaggio elettronico e ho fatto riferimento a uno strumento statistico chiamato “diagramma di Ishikawa”. Questo strumento aiuta a mappare un processo e fornisce un

Prodotti

How rare is indium — and are we running out?

You've seen this in the news before: We are running out of resources. Oil (a perennial favorite), indium (for many years now), or (as of November 2014), chocolate. Name your resource and you can

Prodotti

Thermal Management Using Indium Metal: The Heat-Spring®

Indium metal has long been used for a variety of applications including low-temperature solder, cryogenic sealing, coatings for touch screens, and in fusible alloys. Most recently it has found its

Prodotti

In SMT Statistical Process Control, Cpk is King

Let’s look in on Patty and the team…… Several weeks ago… It was just before Christmas and Patty was heading in to Ivy U from her home in Woodstock, VT. Just as she passed

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EVITARE IL VUOTO®: Vuoto del piano di massa di grandi dimensioni nell'assemblaggio di componenti elettronici: Diagramma di Ishikawa

Avete riscontrato difetti di saldatura? Avete bisogno di aiuto per il vostro processo di assemblaggio elettronico SMT? C'è uno strumento che fa al caso vostro. Gli strumenti statistici, come il Diagramma di Ishikawa, aiutano a tracciare una mappa del processo e a fornire un'idea di

Prodotti

Metal Loading in Solder Paste – A Review (Part 1)

As mentioned in an earlier blog post , a solder paste's alloy type, powder particle size distribution (PSD), and metal loading (weight of metal as a percent or "%w/w") affect the

Supporto

Conclusion of In Electronics Manufacturing, Does Cpk =1 Yield 66,800 defects per million?

Patty, Rob, and Pete were quite sure they understood the confusion in the Cpk = 1 issue, but wanted to make sure they discussed it with the Professor. After a brief chat with him, they called ACME

Prodotti

Materials Lifetimes – A Modest Proposal

Traveling in Malaysia recently, I met up with an old friend (and customer). We got talking about “lifetime” of solder paste: how long could the material survive various process steps

Prodotti

Nella produzione di elettronica, Cpk =1 produce 66.800 difetti per milione?

Gente, mentre Patty passava davanti all'ufficio del professore per andare a trovare Pete e Rob, ha deciso di fare un salto. "Professore, ho ricevuto una telefonata stranissima... un uomo diceva di avere

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Wave Soldering: The Soldering Station – An Introduction

For those of you reading my blog for the first time, you will see that my main focus is on Wave Soldering. I recently completed a series on “preheating” where I talked about the different

Prodotti

Use the Coffin-Manson Equation to Calculate Number of Thermal Cycles

Folks, Let's look in on Patty and friends…. Patty, Rob, and Pete were headed to their regular monthly meeting where they, along with the Professor, discussed a book they were all reading.

In Indium ricerchiamo, sviluppiamo e produciamo materiali avanzati per l'assemblaggio dell'elettronica, in grado di rispondere alle sfide di oggi, di domani e del futuro.