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SAC305 May Not Become De-Facto Standard
Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. With the increased need for shock resistance in
Are There Even Better Performing Thermal Interface Materials available Than Metal?
Multiple times I have discussed the intrinsic properties of metal thermal interface materials which make them the top performer on the market today. With thermal conductivities of 86W/mK, there is
Why Invest in a Great Thermal Interface Material?
There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was the case for most electronics of the
Soldering to Stainless Steel
Have you ever had that sinking feeling when you tried soldering to stainless steel and found it to be very draining? You can join stainless steel, you know, and here's how! You need the correct
Sem halogéneo vs. sem halogeneto
There is a significant push in the electronics industry to produce “halogen-free” products in order to be more environmentally friendly. The industry has begun to adopt the definition of
Package-on-Package Component Dipping (2/5)
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by
Au/Sn – One of a Kind
For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if you don’t factor cost into it). Although the cost of the
Control Your Materials, or They Will Control You (part 1)
Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are
Dosagem de pasta de solda para fixação de moldes
A imagem mostra um "Dispensing Component Kit". Considero-o extremamente útil para verificar rapidamente a sua combinação de pó/agulha. Este kit em particular é fabricado pela EFD. Como
Questions for Tim Jensen
Folks, Tim Jensen, Product Manager, PCB Assembly Materials, would surely be considered one of the most knowledgeable people in lead-free soldering and solder materials. I was able to catch up with
Compreender os problemas de fluência numa pilha de díodos.
A palavra Creep não é algo que um engenheiro queira ouvir quando está a conceber um TIM metálico para a sua pilha de díodos laser. Mas será que a fluência é realmente um problema, e será que compreendemos realmente a fluência quando falamos de
Indium Oxide Layer
There are multiple types of thermal interface materials available, but due to its high thermal conductivity, compressibility, and ease of application, indium metal is one of the most desired thermal
Be Data Driven
Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing "tombstoning" of passives at a major electronic
01005 Passivos Não realmente 01005 em tamanho
Folks, I mentioned this in the quiz at the left, but am I the only one that didn't know that a 01005 passive is really not that size? The designation 01005 means that the passive should be 0.010
Jim Hall partilha novas insígnias no Tin Whiskers
Folks, One of my closest and most respected colleagues in our industry is Jim Hall of ITM. Along with Phil Zarrow, also of ITM, Jim and I developed SMTA's Process Certification Workshop and
O interesse na fórmula para calcular a densidade da liga continua a ser grande
Folks, The technique to calculate density of an alloy still attracts interest about a year after I first discussed it. Although I am pleased to share my Excel software that calculates solder alloy
IPC 1752 Materials Declaration Sheet Ready to Try
Folks, IPC 1752 RoHS Materials Declaration Sheet is ready to evaluate. I see this as a big advance for RoHS compliance. IPC 1752 is free and it is in an easy to use PDF format. The PDF format is a
Tin Pest: Still a Forgotten Concern in Lead Free Assembly
Folks, I am still surprised that so few people are concerned about tin pest in lead-free assembly. Below is an excerpt from a paper I wrote on the topic at SMTAI in September of 2004. The entire
Isenção RoHS para aplicações militares
No seminário Quickstart da Indium na Motorola, Plantation, Flórida (8 e 9 de fevereiro de 2005), o Ed perguntou: Nós fabricamos eletrónica que vai para os navios que são utilizados pelos
Are You Ready For Pb-Free?
I’ve created a Pb-Free Readiness Assessment© tool that is simple and easy to use. And it takes just minutes to complete. Your input is used to rate your progress in each of 4 separate areas.
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Na Indium, investigamos, desenvolvemos e fabricamos soluções avançadas de materiais de montagem de eletrónica para os desafios de hoje, de amanhã e do futuro.

