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SAC305 May Not Become De-Facto Standard

Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. With the increased need for shock resistance in

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Are There Even Better Performing Thermal Interface Materials available Than Metal?

Multiple times I have discussed the intrinsic properties of metal thermal interface materials which make them the top performer on the market today. With thermal conductivities of 86W/mK, there is

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Why Invest in a Great Thermal Interface Material?

There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was the case for most electronics of the

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Soldering to Stainless Steel

Have you ever had that sinking feeling when you tried soldering to stainless steel and found it to be very draining? You can join stainless steel, you know, and here's how! You need the correct

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無鹵素對無鹵素

There is a significant push in the electronics industry to produce “halogen-free” products in order to be more environmentally friendly. The industry has begun to adopt the definition of

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包裝上包裝元件浸漬 (2/5)

Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by

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Au/Sn – One of a Kind

For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if you don’t factor cost into it). Although the cost of the

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Control Your Materials, or They Will Control You (part 1)

Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are

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點膠貼片焊膏

圖中顯示的是 "Dispensing Component Kit"。我發現這對快速驗證粉末/針的組合非常有幫助。這個特殊的套件是由 EFD 組成的。如圖所示

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Questions for Tim Jensen

Folks, Tim Jensen, Product Manager, PCB Assembly Materials, would surely be considered one of the most knowledgeable people in lead-free soldering and solder materials. I was able to catch up with

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了解二極體堆疊的蠕變問題。

當工程師將金屬 TIM 設計成雷射二極體堆疊時,蠕變(Creep)一詞是他們不願意聽到的。但蠕變真的是一個問題嗎?

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Indium Oxide Layer

There are multiple types of thermal interface materials available, but due to its high thermal conductivity, compressibility, and ease of application, indium metal is one of the most desired thermal

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Be Data Driven

Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing "tombstoning" of passives at a major electronic

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01005 Passives Not Really 01005 in Size

Folks, I mentioned this in the quiz at the left, but am I the only one that didn't know that a 01005 passive is really not that size? The designation 01005 means that the passive should be 0.010

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Jim Hall 在鐵鬚上分享新的徽章

Folks, One of my closest and most respected colleagues in our industry is Jim Hall of ITM. Along with Phil Zarrow, also of ITM, Jim and I developed SMTA's Process Certification Workshop and

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對合金密度計算公式的興趣仍然濃厚

Folks, The technique to calculate density of an alloy still attracts interest about a year after I first discussed it. Although I am pleased to share my Excel software that calculates solder alloy

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IPC 1752 Materials Declaration Sheet Ready to Try

Folks, IPC 1752 RoHS Materials Declaration Sheet is ready to evaluate. I see this as a big advance for RoHS compliance. IPC 1752 is free and it is in an easy to use PDF format. The PDF format is a

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Tin Pest: Still a Forgotten Concern in Lead Free Assembly

Folks, I am still surprised that so few people are concerned about tin pest in lead-free assembly. Below is an excerpt from a paper I wrote on the topic at SMTAI in September of 2004. The entire

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軍事應用的 RoHS 豁免

在美國佛羅里達州 Plantation Motorola 舉辦的 Indium 快速入門研討會上 (2005 年 2 月 8 日、9 日) Ed 問到:我們製造的電子產品會用在船舶上,而這些船舶是由軍方使用的。

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Are You Ready For Pb-Free?

I’ve created a Pb-Free Readiness Assessment© tool that is simple and easy to use. And it takes just minutes to complete. Your input is used to rate your progress in each of 4 separate areas.

在 Indium,我們研究、開發並製造先進的電子組裝材料解決方案,以因應今日、明日及未來的挑戰。