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SAC305 May Not Become De-Facto Standard
Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. With the increased need for shock resistance in
Are There Even Better Performing Thermal Interface Materials available Than Metal?
Multiple times I have discussed the intrinsic properties of metal thermal interface materials which make them the top performer on the market today. With thermal conductivities of 86W/mK, there is
Why Invest in a Great Thermal Interface Material?
There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was the case for most electronics of the
Soldering to Stainless Steel
Have you ever had that sinking feeling when you tried soldering to stainless steel and found it to be very draining? You can join stainless steel, you know, and here's how! You need the correct
Sin halógenos frente a sin haluros
There is a significant push in the electronics industry to produce “halogen-free” products in order to be more environmentally friendly. The industry has begun to adopt the definition of
Inmersión de componentes envase a envase (2/5)
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by
Au/Sn – One of a Kind
For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if you don’t factor cost into it). Although the cost of the
Control Your Materials, or They Will Control You (part 1)
Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are
Dispensación de pasta de soldadura Die-Attach
La imagen muestra un "Kit de componentes de dispensación". Creo que es muy útil para verificar rápidamente la combinación de polvo y aguja. Este kit en particular lo fabrica EFD. Como
Questions for Tim Jensen
Folks, Tim Jensen, Product Manager, PCB Assembly Materials, would surely be considered one of the most knowledgeable people in lead-free soldering and solder materials. I was able to catch up with
Comprensión de los problemas de fluencia en un apilamiento de diodos.
La palabra fluencia no es algo que un ingeniero quiera oír cuando diseña un TIM metálico en su pila de diodos láser. Pero, ¿es realmente la fluencia un problema?
Indium Oxide Layer
There are multiple types of thermal interface materials available, but due to its high thermal conductivity, compressibility, and ease of application, indium metal is one of the most desired thermal
Be Data Driven
Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing "tombstoning" of passives at a major electronic
01005 Pasivos No realmente 01005 en tamaño
Folks, I mentioned this in the quiz at the left, but am I the only one that didn't know that a 01005 passive is really not that size? The designation 01005 means that the passive should be 0.010
Jim Hall comparte nuevas insignias en Tin Whiskers
Folks, One of my closest and most respected colleagues in our industry is Jim Hall of ITM. Along with Phil Zarrow, also of ITM, Jim and I developed SMTA's Process Certification Workshop and
La fórmula para calcular la densidad de las aleaciones sigue despertando interés
Folks, The technique to calculate density of an alloy still attracts interest about a year after I first discussed it. Although I am pleased to share my Excel software that calculates solder alloy
IPC 1752 Materials Declaration Sheet Ready to Try
Folks, IPC 1752 RoHS Materials Declaration Sheet is ready to evaluate. I see this as a big advance for RoHS compliance. IPC 1752 is free and it is in an easy to use PDF format. The PDF format is a
Tin Pest: Still a Forgotten Concern in Lead Free Assembly
Folks, I am still surprised that so few people are concerned about tin pest in lead-free assembly. Below is an excerpt from a paper I wrote on the topic at SMTAI in September of 2004. The entire
Exención RoHS para aplicaciones militares
En el seminario Quickstart de Indium en Motorola, Plantation, Fl (8 y 9 de febrero de 2005) Ed preguntó: Hacemos la electrónica que van en los buques que son utilizados por el
Are You Ready For Pb-Free?
I’ve created a Pb-Free Readiness Assessment© tool that is simple and easy to use. And it takes just minutes to complete. Your input is used to rate your progress in each of 4 separate areas.
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Déjenos ayudarle.
En Indium investigamos, desarrollamos y fabricamos materiales avanzados de ensamblaje electrónico para dar respuesta a los retos de hoy, de mañana y del futuro.

