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Folks, Recently I caught up with Ed Briggs, a member of Indium Corporation's technical staff. I asked Ed if he would share with us his thoughts on "graping" and how to minimize it. His

Liquid thermal interface materials are available in two forms: The major difference between the two is in the temperature which these alloys become molten. Liquid metals remain molten at room

Indium Foil used as a thermal interface can easily be handled with pick and place tools. Never worked with indium foil and wondering, "What's all the hype about?" In many ways, indium

How hot are you setting your solder iron for hand soldering using solder wire or preforms? If you are cranking up the solder iron temperature because you have transitioned to lead-free solders, think

En los últimos días, uno de mis compañeros ingenieros de aplicaciones, Jim Hisert, ha publicado un blog en su página web sobre semiconductores acerca de la unión y la soldadura en frío del indio. Se trata de un tema que surge a menudo tanto

I recently visited a customer to help optimize a flux-less indium soldering application. They admitted they needed flux but didn’t know 1) what to use, or 2) if there was a better way to fix

This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or

As previously posted, Indiums Table of Specialty Alloys and Solders contains hundreds of solder alloys used as thermal interface materials and for each of them, we have listed melting temperatures.

As previously posted, Indiums Table of Specialty Alloys҂and solderscontains hundreds of solder alloys and for each of them, we have listed melting temperatures. The method by which these were

¿Busca formas de solucionar problemas u optimizar sus materiales de interfaz térmica? Un método que hemos ideado para determinar el rendimiento de su apilamiento térmico excluyendo la interfaz térmica

Our engineering group recently recieved a personal win when a prospective customer we have been working with for years finally took notice of out Au/Sn advancements and agreed to run a full

Continuing with the topic of thermal interface material options, a popular material choice is a clad metal thermal interface preform including multiple layers of various metals, or a metal preform

Here is a pretty good list of resources on the topic of corrosion, if you’re interested: 1. Chongchen Xu. “Corrosion in Microelectronics“ 2003 2. Charles A. Harper. Electronic

Corrosion is caused by an electrochemical reaction between two dissimilar metals, one acting as an anode – one as a cathode. Halide ions, such as fluoride, bromide, and chloride, are the usual

Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can lower thermal and electrical conductivity, cause

Esta es la primera de una serie de 4 partes sobre la corrosión que cubrirá: 1) Qué es la corrosión, 2) Cómo nos afecta, 3) Fuentes de corrosión y prevención, y 4) Cómo saber más. La corrosión se presenta en 3 formas básicas

When considering the choice of flux for preforms, in addition to factoring in the amount of flux required on a preform, the type of flux is also important. Fluxes are categorized using the

Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. With the increased need for shock resistance in

Multiple times I have discussed the intrinsic properties of metal thermal interface materials which make them the top performer on the market today. With thermal conductivities of 86W/mK, there is

There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was the case for most electronics of the

Have you ever had that sinking feeling when you tried soldering to stainless steel and found it to be very draining? You can join stainless steel, you know, and here's how! You need the correct