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Ed Briggs Weighs in on “Graping”

Folks, Recently I caught up with Ed Briggs, a member of Indium Corporation's technical staff. I asked Ed if he would share with us his thoughts on "graping" and how to minimize it. His

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Thermische Grenzflächenmaterialien aus Flüssigmetall 1

Liquid thermal interface materials are available in two forms: The major difference between the two is in the temperature which these alloys become molten. Liquid metals remain molten at room

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Indium Foil – a Thermal Interface Material

Indium Foil used as a thermal interface can easily be handled with pick and place tools. Never worked with indium foil and wondering, "What's all the hype about?" In many ways, indium

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Hand Soldering Tip Temperatures

How hot are you setting your solder iron for hand soldering using solder wire or preforms? If you are cranking up the solder iron temperature because you have transitioned to lead-free solders, think

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Indium-Kontaktierung und Indium-Kaltschweißung

In den letzten Tagen hat einer meiner Kollegen, der Anwendungstechniker Jim Hisert, auf seiner Halbleiter-Website einen Blog über Indium-Bonden und Indium-Kaltschweißen veröffentlicht. Dies ist ein Thema, das häufig auftaucht, sowohl

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Stock Up

I recently visited a customer to help optimize a flux-less indium soldering application. They admitted they needed flux but didn’t know 1) what to use, or 2) if there was a better way to fix

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Pin Transfer Basics

This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or

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Determine Solidus and Liquidus Temperatures of Solder Thermal Interface Materials

As previously posted, Indiums Table of Specialty Alloys and Solders contains hundreds of solder alloys used as thermal interface materials and for each of them, we have listed melting temperatures.

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Bestimmung der Solidus- und Liquidustemperaturen von Lötlegierungen

As previously posted, Indiums Table of Specialty Alloys҂and solderscontains hundreds of solder alloys and for each of them, we have listed melting temperatures. The method by which these were

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Achtung Thermotester

Suchen Sie nach Möglichkeiten zur Fehlersuche oder Optimierung Ihrer thermischen Schnittstellenmaterialien? Eine Methode, die wir entwickelt haben, um die Leistung Ihres thermischen Stapels zu bestimmen, schließt die thermische Schnittstelle aus

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Au/Sn (Jedermanns bester Freund)

Our engineering group recently recieved a personal win when a prospective customer we have been working with for years finally took notice of out Au/Sn advancements and agreed to run a full

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Verkleidete thermische Grenzflächenmaterialien

Continuing with the topic of thermal interface material options, a popular material choice is a clad metal thermal interface preform including multiple layers of various metals, or a metal preform

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Corrosion – Part 4, Learn More

Here is a pretty good list of resources on the topic of corrosion, if you’re interested: 1. Chongchen Xu. “Corrosion in Microelectronics“ 2003 2. Charles A. Harper. Electronic

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Korrosion - Teil 3, Quellen und Prävention

Corrosion is caused by an electrochemical reaction between two dissimilar metals, one acting as an anode – one as a cathode. Halide ions, such as fluoride, bromide, and chloride, are the usual

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Korrosion - Teil 2: Wie sie sich auf uns auswirkt

Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can lower thermal and electrical conductivity, cause

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Korrosion - Teil 1, was sie ist

Dies ist der erste Teil einer 4-teiligen Serie über Korrosion, die folgende Themen behandelt: 1) Was Korrosion ist, 2) Wie sie sich auf uns auswirkt, 3) Korrosionsursachen und -prävention und 4) Wie man mehr darüber erfährt. Korrosion gibt es in 3 Grundformen

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Preform-Flussmittel-Typen

When considering the choice of flux for preforms, in addition to factoring in the amount of flux required on a preform, the type of flux is also important. Fluxes are categorized using the

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SAC305 May Not Become De-Facto Standard

Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. With the increased need for shock resistance in

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Are There Even Better Performing Thermal Interface Materials available Than Metal?

Multiple times I have discussed the intrinsic properties of metal thermal interface materials which make them the top performer on the market today. With thermal conductivities of 86W/mK, there is

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Why Invest in a Great Thermal Interface Material?

There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was the case for most electronics of the

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Soldering to Stainless Steel

Have you ever had that sinking feeling when you tried soldering to stainless steel and found it to be very draining? You can join stainless steel, you know, and here's how! You need the correct

Bei Indium erforschen, entwickeln und produzieren wir fortschrittliche Materialien für die Elektronikmontage, die den Herausforderungen von heute, morgen und übermorgen gewachsen sind.