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SAC305 May Not Become De-Facto Standard
Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. With the increased need for shock resistance in
금속보다 성능이 더 우수한 열전도성 접촉재가 존재할까?
Multiple times I have discussed the intrinsic properties of metal thermal interface materials which make them the top performer on the market today. With thermal conductivities of 86W/mK, there is
Why Invest in a Great Thermal Interface Material?
There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was the case for most electronics of the
Soldering to Stainless Steel
Have you ever had that sinking feeling when you tried soldering to stainless steel and found it to be very draining? You can join stainless steel, you know, and here's how! You need the correct
할로겐 무함유 대 할로겐 무함유
There is a significant push in the electronics industry to produce “halogen-free” products in order to be more environmentally friendly. The industry has begun to adopt the definition of
패키지 온 패키지 구성 요소 담그기(2/5)
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by
Au/Sn – One of a Kind
For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if you don’t factor cost into it). Although the cost of the
Control Your Materials, or They Will Control You (part 1)
Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are
다이-부착 솔더 페이스트 디스펜싱
사진은 "디스펜싱 구성품 키트"를 보여줍니다. 파우더/니들 조합을 빠르게 확인하는 데 매우 유용합니다. 이 특정 키트는 EFD에서 제작했습니다. As
Questions for Tim Jensen
Folks, Tim Jensen, Product Manager, PCB Assembly Materials, would surely be considered one of the most knowledgeable people in lead-free soldering and solder materials. I was able to catch up with
다이오드 스택의 크리프 문제 이해하기.
레이저 다이오드 스택에 금속 TIM을 설계할 때 엔지니어가 크리프라는 단어를 듣고 싶지 않을 것입니다. 하지만 크리프가 정말 문제가 될까요, 그리고 크리프를 제대로 이해하고 있을까요?
Indium Oxide Layer
There are multiple types of thermal interface materials available, but due to its high thermal conductivity, compressibility, and ease of application, indium metal is one of the most desired thermal
Be Data Driven
Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing "tombstoning" of passives at a major electronic
01005 패시브가 실제로는 01005 크기가 아닙니다.
Folks, I mentioned this in the quiz at the left, but am I the only one that didn't know that a 01005 passive is really not that size? The designation 01005 means that the passive should be 0.010
짐 홀, 주석 수염의 새로운 휘장을 공유하다
Folks, One of my closest and most respected colleagues in our industry is Jim Hall of ITM. Along with Phil Zarrow, also of ITM, Jim and I developed SMTA's Process Certification Workshop and
합금 밀도 계산 공식에 대한 관심은 여전히 뜨겁습니다.
Folks, The technique to calculate density of an alloy still attracts interest about a year after I first discussed it. Although I am pleased to share my Excel software that calculates solder alloy
IPC 1752 Materials Declaration Sheet Ready to Try
Folks, IPC 1752 RoHS Materials Declaration Sheet is ready to evaluate. I see this as a big advance for RoHS compliance. IPC 1752 is free and it is in an easy to use PDF format. The PDF format is a
Tin Pest: Still a Forgotten Concern in Lead Free Assembly
Folks, I am still surprised that so few people are concerned about tin pest in lead-free assembly. Below is an excerpt from a paper I wrote on the topic at SMTAI in September of 2004. The entire
군용 애플리케이션에 대한 RoHS 면제
2005년 2월 8일과 9일, 플로리다 플랜테이션의 모토로라에서 열린 인디엄의 퀵스타트 세미나에서 Ed가 물었습니다: 우리는 선박에 탑재되는 전자 제품을 만들고 있습니다.
Are You Ready For Pb-Free?
I’ve created a Pb-Free Readiness Assessment© tool that is simple and easy to use. And it takes just minutes to complete. Your input is used to rate your progress in each of 4 separate areas.
필요한 것이 무엇인지 잘 모르시겠어요?
도와드리겠습니다.
Indium은 현재와 미래, 그리고 미래의 과제를 해결하기 위한 첨단 전자 조립 재료 솔루션을 연구, 개발 및 제조합니다.

