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SAC305 May Not Become De-Facto Standard
Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. With the increased need for shock resistance in
Are There Even Better Performing Thermal Interface Materials available Than Metal?
Multiple times I have discussed the intrinsic properties of metal thermal interface materials which make them the top performer on the market today. With thermal conductivities of 86W/mK, there is
Why Invest in a Great Thermal Interface Material?
There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was the case for most electronics of the
Soldering to Stainless Steel
Have you ever had that sinking feeling when you tried soldering to stainless steel and found it to be very draining? You can join stainless steel, you know, and here's how! You need the correct
Sans halogène ou sans halogénure
There is a significant push in the electronics industry to produce “halogen-free” products in order to be more environmentally friendly. The industry has begun to adopt the definition of
Package-on-Package Component Dipping (2/5)
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by
Au/Sn – One of a Kind
For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if you don’t factor cost into it). Although the cost of the
Contrôlez vos matériaux, ou ils vous contrôleront (partie 1)
Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are
Dépose de pâte à braser Die-Attach
L'image montre un "kit de composants d'application". Je trouve que ce kit est extrêmement utile pour vérifier rapidement votre combinaison poudre/aiguille. Ce kit particulier est fabriqué par EFD. En tant que
Questions à Tim Jensen
Folks, Tim Jensen, Product Manager, PCB Assembly Materials, would surely be considered one of the most knowledgeable people in lead-free soldering and solder materials. I was able to catch up with
Comprendre les problèmes de fluage sur un empilement de diodes.
Le mot "fluage" n'est pas quelque chose qu'un ingénieur souhaite entendre lorsqu'il conçoit un TIM métallique dans son empilement de diodes laser. Mais le fluage est-il vraiment un problème, et le comprenons-nous vraiment lorsque nous parlons de fluage ?
Indium Oxide Layer
There are multiple types of thermal interface materials available, but due to its high thermal conductivity, compressibility, and ease of application, indium metal is one of the most desired thermal
S'appuyer sur les données
Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing "tombstoning" of passives at a major electronic
01005 Passives Pas vraiment 01005 en taille
Folks, I mentioned this in the quiz at the left, but am I the only one that didn't know that a 01005 passive is really not that size? The designation 01005 means that the passive should be 0.010
Jim Hall partage ses nouveaux insignes sur Tin Whiskers
Folks, One of my closest and most respected colleagues in our industry is Jim Hall of ITM. Along with Phil Zarrow, also of ITM, Jim and I developed SMTA's Process Certification Workshop and
L'intérêt pour la formule de calcul de la densité des alliages ne se dément pas
Folks, The technique to calculate density of an alloy still attracts interest about a year after I first discussed it. Although I am pleased to share my Excel software that calculates solder alloy
IPC 1752 Materials Declaration Sheet Ready to Try
Folks, IPC 1752 RoHS Materials Declaration Sheet is ready to evaluate. I see this as a big advance for RoHS compliance. IPC 1752 is free and it is in an easy to use PDF format. The PDF format is a
Tin Pest: Still a Forgotten Concern in Lead Free Assembly
Folks, I am still surprised that so few people are concerned about tin pest in lead-free assembly. Below is an excerpt from a paper I wrote on the topic at SMTAI in September of 2004. The entire
Exemption RoHS pour les applications militaires
Lors du séminaire Quickstart d'Indium à Motorola, Plantation, Floride (8 et 9 février 2005), Ed a posé une question : Nous fabriquons des composants électroniques qui sont embarqués sur des navires utilisés par la marine américaine.
Are You Ready For Pb-Free?
I’ve created a Pb-Free Readiness Assessment© tool that is simple and easy to use. And it takes just minutes to complete. Your input is used to rate your progress in each of 4 separate areas.
Vous n'êtes pas sûr de ce dont vous avez besoin ?
Laissez-nous vous aider.
Chez Indium, nous recherchons, développons et fabriquons des matériaux d'assemblage électroniques avancés pour répondre aux défis d'aujourd'hui, de demain et de l'avenir.

