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Indium Corporation Technical Papers Accepted for APEX Technical Conference

Indium Corporation had three technical papers accepted for presentation at APEX in Las Vegas, Nevada, March 29 – April 5, 2009.

Tim Jensen, Solder Paste Product Manager, authored Challenges in Implementing a Halogen-Free Process, which focuses on the process development challenges in implementing a halogen-free assembly process, including solder paste evaluation and selection, solder fluxes, the SMT stencil printing process, reflow, and test.
Thursday, April 2, 10:15am – 11:45am

A "Flash Abstract" video is available for this technical paper, however you must have both Javascript and Flash enabled in order to view it.

Mario Scalzo, Senior Technical Support Engineer, authored Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly, which discusses the two main sources of head-in-pillow defects and solutions for their elimination.
Tuesday, March 31, 1:30pm – 3:00pm

A "Flash Abstract" video is available for this technical paper, however you must have both Javascript and Flash enabled in order to view it.

Chris Anglin, Technical Support Engineer, authored Establishing a Precision Stencil Printing Process. Chris’s paper summarizes a significant amount of experimental data and process optimization techniques used to establish a precision SMT printing process.
Wednesday, April 1, 1:30pm – 3:00pm

A "Flash Abstract" video is available for this technical paper, however you must have both Javascript and Flash enabled in order to view it.

Sponsored by IPC, this technical conference is known worldwide as one of the finest and most selective in the world.   

Tim Jensen has a bachelor’s degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.

Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor’s degree in Chemistry from Saint Anselm College. He also holds a certificate from the American Chemical Society for Professional Education. In addition, he is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College’s Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.

Chris Anglin tem mais de 15 anos de experiência em desenvolvimento de processos avançados, introdução de novos produtos e fabrico de conjuntos electrónicos. Tem um mestrado em Engenharia Industrial pela Universidade Estatal de Nova Iorque em Binghamton. Tem formação em programas Six Sigma Black Belt e é também um engenheiro de processos certificado pela SMTA.

A Indium Corporation é um dos principais fornecedores de materiais para os mercados globais de montagem de eletrónica, fabrico e embalagem de semicondutores, energia solar fotovoltaica e gestão térmica. Fundada em 1934, a empresa oferece uma vasta gama de produtos, serviços e apoio técnico centrados na ciência de materiais avançados. Com instalações na RPC, Singapura, Coreia do Sul, Reino Unido e EUA, a empresa é quatro vezes vencedora do prémio Frost & Sullivan e está registada na norma ISO-9001.

For more information about the technical conferences and APEX, visit http://www.goipcshows.org.

Para mais informações sobre a Indium Corporation, visite https://www.indium.com ou envie um e-mail para [email protected].