Indium Corporation Technical Papers Accepted for APEX Technical Conference

Indium Corporation had three technical papers accepted for presentation at APEX in Las Vegas, Nevada, March 29 – April 5, 2009.

Tim Jensen, Solder Paste Product Manager, authored Challenges in Implementing a Halogen-Free Process, which focuses on the process development challenges in implementing a halogen-free assembly process, including solder paste evaluation and selection, solder fluxes, the SMT stencil printing process, reflow, and test.
– Thursday, April 2, 10:15am – 11:45am

Mario Scalzo, Senior Technical Support Engineer, authored Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly, which discusses the two main sources of head-in-pillow defects and solutions for their elimination.
– Tuesday, March 31, 1:30pm – 3:00pm

Chris Anglin, Technical Support Engineer, authored Establishing a Precision Stencil Printing Process. Chris’s paper summarizes a significant amount of experimental data and process optimization techniques used to establish a precision SMT printing process.
– Wednesday, April 1, 1:30pm – 3:00pm

Sponsored by IPC, this technical conference is known worldwide as one of the finest and most selective in the world.   

Tim Jensen has a bachelor’s degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.

Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor’s degree in Chemistry from Saint Anselm College. He also holds a certificate from the American Chemical Society for Professional Education. In addition, he is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College’s Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.

Chris Anglin 在先進製程開發、新產品導入和電子組裝製造領域擁有超過 15 年的經驗。 他擁有紐約州立大學賓漢姆頓分校的工業工程碩士學位。他接受過六西格玛黑帶計畫的訓練，同時也是 SMTA 認證的製程工程師。

Indium Corporation 是全球電子組裝、半導體製造和封裝、太陽能光電和熱管理市場的主要材料供應商。 公司成立於 1934 年，提供廣泛的產品、服務和技術支援，專注於先進材料科學。 公司在中國、新加坡、韓國、英國和美國均設有工廠，曾四次榮獲 Frost & Sullivan 大獎，並已註冊 ISO-9001。

For more information about the technical conferences and APEX, visit http://www.goipcshows.org.

For more information about Indium Corporation, visit https://www.indium.com or email [email protected].