Indium Corporation Technical Papers Accepted for APEX Technical Conference

Indium Corporation had three technical papers accepted for presentation at APEX in Las Vegas, Nevada, March 29 – April 5, 2009.

Tim Jensen, Solder Paste Product Manager, authored Challenges in Implementing a Halogen-Free Process, which focuses on the process development challenges in implementing a halogen-free assembly process, including solder paste evaluation and selection, solder fluxes, the SMT stencil printing process, reflow, and test.
– Thursday, April 2, 10:15am – 11:45am

Mario Scalzo, Senior Technical Support Engineer, authored Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly, which discusses the two main sources of head-in-pillow defects and solutions for their elimination.
– Tuesday, March 31, 1:30pm – 3:00pm

Chris Anglin, Technical Support Engineer, authored Establishing a Precision Stencil Printing Process. Chris’s paper summarizes a significant amount of experimental data and process optimization techniques used to establish a precision SMT printing process.
– Wednesday, April 1, 1:30pm – 3:00pm

Sponsored by IPC, this technical conference is known worldwide as one of the finest and most selective in the world.   

Tim Jensen has a bachelor’s degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.

Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor’s degree in Chemistry from Saint Anselm College. He also holds a certificate from the American Chemical Society for Professional Education. In addition, he is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College’s Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.

Chris Anglin has over 15 years of experience in advanced process development, new product introduction, and electronics assembly manufacturing.  He has a master’s degree in Industrial Engineering from the State University of New York at Binghamton. He is trained in Six Sigma Black Belt programs and is also an SMTA-certified process engineer.

인듐 코퍼레이션(Indium Corporation)은 전 세계 전자 조립, 반도체 제조 및 패키징, 태양광 발전, 열 관리 시장에 소재를 공급하는 선도적인 기업입니다. 1934년에 설립된 이 회사는 첨단 소재 과학에 중점을 둔 광범위한 제품, 서비스 및 기술 지원을 제공합니다.  중국, 싱가포르, 한국, 영국 및 미국에 생산 시설을 갖춘 이 회사는 프로스트 앤 설리번(Frost & Sullivan) 어워드를 4회 수상했으며, ISO-9001 인증을 획득했습니다.

For more information about the technical conferences and APEX, visit http://www.goipcshows.org.

인듐 코퍼레이션에 대한 자세한 정보는 https://www.indium.com을 방문하거나 [email protected]으로 이메일을 보내 주시기 바랍니다.