Indium Corporation had three technical papers accepted for presentation at APEX in Las Vegas, Nevada, March 29 – April 5, 2009.
Tim Jensen, Solder Paste Product Manager, authored Challenges in Implementing a Halogen-Free Process, which focuses on the process development challenges in implementing a halogen-free assembly process, including solder paste evaluation and selection, solder fluxes, the SMT stencil printing process, reflow, and test.
– Thursday, April 2, 10:15am – 11:45am
A "Flash Abstract" video is available for this technical paper, however you must have both Javascript and Flash enabled in order to view it.
Mario Scalzo, Senior Technical Support Engineer, authored Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly, which discusses the two main sources of head-in-pillow defects and solutions for their elimination.
– Tuesday, March 31, 1:30pm – 3:00pm
A "Flash Abstract" video is available for this technical paper, however you must have both Javascript and Flash enabled in order to view it.
Chris Anglin, Technical Support Engineer, authored Establishing a Precision Stencil Printing Process. Chris’s paper summarizes a significant amount of experimental data and process optimization techniques used to establish a precision SMT printing process.
– Wednesday, April 1, 1:30pm – 3:00pm
A "Flash Abstract" video is available for this technical paper, however you must have both Javascript and Flash enabled in order to view it.
Sponsored by IPC, this technical conference is known worldwide as one of the finest and most selective in the world.
Tim Jensen has a bachelor’s degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.
Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor’s degree in Chemistry from Saint Anselm College. He also holds a certificate from the American Chemical Society for Professional Education. In addition, he is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College’s Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.
クリス・アングリンは、先端プロセス開発、新製品導入、電子機器組立製造において15年以上の経験を持つ。 ニューヨーク州立大学ビンガムトン校で生産工学の修士号を取得。シックスシグマ・ブラックベルト・プログラムの訓練を受け、SMTA認定プロセスエンジニアでもある。
インジウム・コーポレーションは、エレクトロニクス・アセンブリ、半導体製造およびパッケージング、太陽光発電、および熱管理市場に製品を供給する世界有数の材料サプライヤーである。 1934年に設立された同社は、先端材料科学に焦点を当てた幅広い製品、サービス、技術サポートを提供している。 中国、シンガポール、韓国、英国、米国に拠点を持ち、フロスト＆サリバン賞を4度受賞、ISO-9001に登録されている。
For more information about the technical conferences and APEX, visit http://www.goipcshows.org.
For more information about Indium Corporation, visit https://www.indium.com or email [email protected].
