Indium Corporation Technical Papers Accepted for APEX Technical Conference

Indium Corporation had three technical papers accepted for presentation at APEX in Las Vegas, Nevada, March 29 – April 5, 2009.

Tim Jensen, Solder Paste Product Manager, authored Challenges in Implementing a Halogen-Free Process, which focuses on the process development challenges in implementing a halogen-free assembly process, including solder paste evaluation and selection, solder fluxes, the SMT stencil printing process, reflow, and test.
– Thursday, April 2, 10:15am – 11:45am

Mario Scalzo, Senior Technical Support Engineer, authored Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly, which discusses the two main sources of head-in-pillow defects and solutions for their elimination.
– Tuesday, March 31, 1:30pm – 3:00pm

Chris Anglin, Technical Support Engineer, authored Establishing a Precision Stencil Printing Process. Chris’s paper summarizes a significant amount of experimental data and process optimization techniques used to establish a precision SMT printing process.
– Wednesday, April 1, 1:30pm – 3:00pm

Sponsored by IPC, this technical conference is known worldwide as one of the finest and most selective in the world.   

Tim Jensen has a bachelor’s degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.

Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor’s degree in Chemistry from Saint Anselm College. He also holds a certificate from the American Chemical Society for Professional Education. In addition, he is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College’s Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.

Chris Anglin has over 15 years of experience in advanced process development, new product introduction, and electronics assembly manufacturing.  He has a master’s degree in Industrial Engineering from the State University of New York at Binghamton. He is trained in Six Sigma Black Belt programs and is also an SMTA-certified process engineer.

Indium Corporation 是全球电子组装、半导体制造和封装、太阳能光伏和热管理市场的主要材料供应商。 公司成立于 1934 年，以先进材料科学为核心，提供广泛的产品、服务和技术支持。 公司在中国、新加坡、韩国、英国和美国均设有工厂，曾四次荣获 Frost & Sullivan 奖，并通过了 ISO-9001 认证。

For more information about the technical conferences and APEX, visit http://www.goipcshows.org.

For more information about Indium Corporation, visit https://www.indium.com or email [email protected].