Indium Corporation Technical Papers Accepted for APEX Technical Conference

Indium Corporation had three technical papers accepted for presentation at APEX in Las Vegas, Nevada, March 29 – April 5, 2009.

Tim Jensen, Solder Paste Product Manager, authored Challenges in Implementing a Halogen-Free Process, which focuses on the process development challenges in implementing a halogen-free assembly process, including solder paste evaluation and selection, solder fluxes, the SMT stencil printing process, reflow, and test.
– Thursday, April 2, 10:15am – 11:45am

Mario Scalzo, Senior Technical Support Engineer, authored Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly, which discusses the two main sources of head-in-pillow defects and solutions for their elimination.
– Tuesday, March 31, 1:30pm – 3:00pm

Chris Anglin, Technical Support Engineer, authored Establishing a Precision Stencil Printing Process. Chris’s paper summarizes a significant amount of experimental data and process optimization techniques used to establish a precision SMT printing process.
– Wednesday, April 1, 1:30pm – 3:00pm

Sponsored by IPC, this technical conference is known worldwide as one of the finest and most selective in the world.   

Tim Jensen has a bachelor’s degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.

Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor’s degree in Chemistry from Saint Anselm College. He also holds a certificate from the American Chemical Society for Professional Education. In addition, he is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College’s Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.

Chris Anglin has over 15 years of experience in advanced process development, new product introduction, and electronics assembly manufacturing.  He has a master’s degree in Industrial Engineering from the State University of New York at Binghamton. He is trained in Six Sigma Black Belt programs and is also an SMTA-certified process engineer.

Die Indium Corporation ist ein führender Materiallieferant für die weltweiten Märkte der Elektronikmontage, der Halbleiterherstellung und -verpackung, der Solar-Photovoltaik und des Wärmemanagements. Das 1934 gegründete Unternehmen bietet eine breite Palette an Produkten, Dienstleistungen und technischem Support mit Schwerpunkt auf fortschrittlicher Materialwissenschaft. Das Unternehmen verfügt über Niederlassungen in der VR China, Singapur, Südkorea, Großbritannien und den USA, wurde viermal mit dem Frost & Sullivan Award ausgezeichnet und ist nach ISO-9001 registriert.

For more information about the technical conferences and APEX, visit http://www.goipcshows.org.

Weitere Informationen über die Indium Corporation erhalten Sie unter https://www.indium.com oder per E-Mail an [email protected].