Indium Corporation Technical Papers Accepted for APEX Technical Conference

Indium Corporation had three technical papers accepted for presentation at APEX in Las Vegas, Nevada, March 29 – April 5, 2009.

Tim Jensen, Solder Paste Product Manager, authored Challenges in Implementing a Halogen-Free Process, which focuses on the process development challenges in implementing a halogen-free assembly process, including solder paste evaluation and selection, solder fluxes, the SMT stencil printing process, reflow, and test.
– Thursday, April 2, 10:15am – 11:45am

Mario Scalzo, Senior Technical Support Engineer, authored Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly, which discusses the two main sources of head-in-pillow defects and solutions for their elimination.
– Tuesday, March 31, 1:30pm – 3:00pm

Chris Anglin, Technical Support Engineer, authored Establishing a Precision Stencil Printing Process. Chris’s paper summarizes a significant amount of experimental data and process optimization techniques used to establish a precision SMT printing process.
– Wednesday, April 1, 1:30pm – 3:00pm

Sponsored by IPC, this technical conference is known worldwide as one of the finest and most selective in the world.   

Tim Jensen has a bachelor’s degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.

Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor’s degree in Chemistry from Saint Anselm College. He also holds a certificate from the American Chemical Society for Professional Education. In addition, he is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College’s Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.

Chris Anglin a plus de 15 ans d'expérience dans le développement de processus avancés, l'introduction de nouveaux produits et la fabrication d'assemblages électroniques. Il est titulaire d'une maîtrise en ingénierie industrielle de l'université d'État de New York à Binghamton. Il est formé aux programmes Six Sigma Black Belt et est également un ingénieur de processus certifié SMTA.

Indium Corporation est un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'assemblage électronique, de la fabrication et de l'emballage de semi-conducteurs, de l'énergie solaire photovoltaïque et de la gestion thermique. Fondée en 1934, l'entreprise propose une large gamme de produits, de services et d'assistance technique axés sur la science des matériaux avancés. Avec des installations en RPC, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis, l'entreprise a remporté quatre fois le prix Frost & Sullivan et est enregistrée selon la norme ISO-9001.

For more information about the technical conferences and APEX, visit http://www.goipcshows.org.

Pour plus d'informations sur Indium Corporation, visitez le site https://www.indium.com ou envoyez un courriel à [email protected].