InFORMS^® Reinforced Preforms

Overview of InFORMS® In the world of electronics manufacturing, especially in high-stress applications like power modules and electric vehicle inverters, ensuring the reliability and durability

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to

Seth Homer: As we've discussed, there are three attach levels of peak concern in the IGBT stack up. At Indium Corporation, we're redefining how we use solder at the die-attach, substrate, and

This is the last in a series of posts that discusses reinforced Solder Preforms for high–reliability and low voiding. This post will focus on the results of our DOE to find out if we did, in

This is the fourth in a series of blog posts that talks about reinforced Solder Preforms for high–reliability and low

This is the second in a series of blog posts that talks about Reinforced Solder Preforms for High–Reliability and Low Voiding. This post will focus on the technology advancement of InFORMS®

Winter is upon us, especially here in the Northeast