Indium Blog

Advanced Packaging Week (Day 5)

  • Indium
  • Indium Corporation
  • Thermal Interface Materials

  • Comparing Package Bond Thermal Performance” by John Parry (Mentor Graphics Corp.) is the final article of Advanced Packaging week.  Speaking for our thermal team, I’m sure they would love to see this system used to model CPUs and GPUs with and without Indium thermal interface materials.  If anyone out there is interested in Indium thermal materials, send us an email.



    Authored by previous Indium Application Manager Jim Hisert