In my previous blog post on formic acid soldering, I explained the technology of formic acid reflow soldering, the applications in which it can be beneficial over traditional reflow soldering, the process intricacies, and potential challenges that may be faced when adopting this approach. I also briefly introduced Indium Corporation’s FAST product line, specifically engineered for formic acid reflow soldering.
In this post, we’ll look more deeply at the products, especially the Formic Acid Soldering Technology (FAST) Paste I am actively working on – an innovative solder paste engineered for formic acid soldering applications. We’ll explore how Indium Corporation’s FAST Product line simplifies the adoption of formic acid reflow soldering, giving users a portfolio of materials and more process options.
What Makes FAST Paste a Game-Changer?
Traditional solder pastes used in a traditional reflow process depend on flux components to clean oxides and promote solder wetting. In most cases, especially in power electronics packaging, the post-reflow residues must be cleaned to ensure device reliability. With formic acid reflow soldering, the formic acid takes care of the fluxing role. FAST Paste is specifically designed for this process; the flux is replaced by a complex binder of solvents and thixotropic additives, providing excellent workability while eliminating the need for post-reflow cleaning.
Here’s why FAST Paste stands out from conventional solder pastes:
- No-Clean Process Flow: The innovative binder in FAST Paste completely evaporates during reflow, leaving virtually zero residue with no cleaning needed.
- Simplified Workflow: The elimination of post-reflow cleaning means faster total cycle time, fewer process steps, and reduced process risk.
- Enhanced Downstream Compatibility: With a clean, residue-free finish, assemblies soldered with FAST Paste are ready for delicate downstream steps like wire-bonding, molding, and encapsulation.
Optimized for Formic Acid Reflow
Adoption of formic acid reflow soldering is increasing. Recognized for its clean, fluxless process and low-void joint formation, formic acid serves as a powerful reducing agent to remove oxides during reflow. FAST Paste is crafted for this environment, maximizing all the advantages of formic acid soldering and providing users with increased process flexibility and material options.
Key advantages of FAST Paste in formic acid reflow soldering:
- Exceptional Wetting and Reliability: The FAST Paste binder system evaporates before the alloy liquidus temperature, allowing the formic acid to penetrate and clean surface oxides and promote proper wetting.
- Ultra-Low Voiding: Volatile flux components can contribute to solder voids from entrapped outgassing. FAST paste eliminates these components, resulting in ultra-low voiding, especially when a vacuum is applied during reflow.
- Versatile Application: With excellent workability for both stencil printing and dispensing, FAST Paste is a feasible solution for die-attach, clip-attach, pin-soldering, and thermistor-soldering, making it ideal for modern power electronics.
Tailored for Next-Gen Power Electronics
Every assembly line is different. That’s why FAST Paste is available in a wide range of solder alloys, designed for diverse needs and requirements.
Lead-Free Alloys
Environmentally responsible manufacturing is the new standard in power electronics. Choose FAST Paste in lead-free alloys like SAC305, SnAg3.5, or other Indium Corporation proprietary high-reliability blends to make a sustainable choice without sacrificing performance.
High-Lead Alloys
Specialized tasks, such as discrete power device die-attach or clip-attach, demand robust high-lead solutions. FAST Paste delivers excellent mechanical strength and minimal voiding, even after extensive thermal cycling.
Whatever your alloy of choice, you can trust FAST Paste to deliver consistent, high-quality results.
Your Development Partner in Fluxless Soldering
Indium Corporation provides cutting edge materials for the most state-of-the-art processes, and formic acid reflow is no exception. Thanks to our long history and proven track record in solder technologies and material development, power electronics manufacturers look to us for innovative material solutions that power the adoption of formic acid reflow soldering. Whether you are developing next-gen EV inverters, industrial power modules, or other advanced electronics, FAST Paste can be tailored for your process.
Working with Indium Corporation gives you access to a team of soldering experts dedicated to your success, providing hands-on support for optimization, testing, and qualification.
More Than Just Paste—A Complete Solution
While FAST Paste is the star of fluxless soldering innovation, it’s only part of Indium Corporation’s full suite of formic acid soldering technologies. From precise preforms and InTACK® tacking agents to high-reliability alloys, our product portfolio has your needs covered for clean, reliable assembly.
