Indium Blog

Indium and Flip Chip Bonding

  • Chip Attach
  • Indium
  • Indium Corporation
  • Solder
  • Soldering
  • Solder Bumping
  • Solder Reliability
  • Solderability

  • Au stud bumped flip chip attachment?  Low temperature assembly requirements? Indium is your answer…






    Indium can be used in many ingenious ways to attach flip chips.  It can be used for solder interconnections, cold-weld attachments, and even low temperature solid-state diffusion bonding.  The pliable nature of indium allows it to perform well during reliability testing - such as temperature cycling.