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Blog
Topic
Type
Year
Author
Product Type
Revolutionizing Electronics Assembly: The Future of Robotic Soldering
As challenges and complexities associated with manual soldering processes increase, the installation and utilization of robotic soldering stations continue to grow. These challenges include the
Halide Free vs. Halogen Free: A Refresher
Recently, I've fielded several requests to clarify the distinction between "halide-free" and "halogen-free." Both terms apply to the composition of soldering fluxes in the
Metal TIMs 101: Chapter 1
Folks, Dr. Ron: For my next several posts, I would like to chat with Indium Corporation’s metal thermal interface materials (TIMs) Product Manager, Jon Major, about metal TIMs. Jon, can you tell us
Empowering Women in Engineering, Today and Everyday
Happy International Women in Engineering Day! Science was once considered a male-dominated field, with many important discoveries spearheaded by women gone unnoticed. That is no longer true, and as a
Acceleration Factor Correction
Folks, About a year ago, I posted on acceleration factors in temperature stress testing. See the equation in Equation 1 below. I made a mistake with the exponent, it should not be 5.5, but 2.65. The
Patty and The Professor 15th Anniversary
Folks, It is hard to imagine that it has been 15 years since “The Adventures of Patty and the Professor” debuted. It started with a few blog posts and it just kept on going on and on,
Square vs Circular Apertures May Reduce Graping
Dear Dr. Ron, We are experiencing some graping on BGA solder joints. One of my colleagues said he heard that using square versus our current round stencil apertures might solve the
Conclusion to: Profits are Down. Could a Cheaper Solder Paste Have Caused it?
Folks, Let's see how Ivy Universitygraduate student Maria Gonzales is handling her assignment to find the lost profits a Liberty Elecronics… Maria had never been so nervous. She was going
Profits are Down. Could a Cheaper Solder Paste Have Caused It?
Folks, Let's see how Professor Patty is doing… Professor Patty Coleman stared out of her office window at the waning remnants of snow on Ivy University’s campus. She was bummed that
Book Review: Chip War
Folks, It gives me pause to think that I have lived through most of the electronics revolution. One of my first memories is that my family, along with most others, did not own a
Metal Mass Fraction Calculator
Folks, Can it be almost 20 years ago that I developed the solder alloy density calculator? I have received more requests on this topic than any other. It surprises most people that the formula for
Wave Solder Calculator
Folks, I remember in 1994 (can it be 30 years ago?) that a colleague commented that in 5 years, wave soldering would go away. Well, 30 years have passed and wave soldering is still with us. Since
How to Calculated Equivalent Cp and Cpk when Spec Limits are Not Symmetrical
Folks, Cp and Cpk assume symmetrical specification limits with respect to the target. However, sometimes specification limits are not symmetrical. As an example, IPC 610 suggests that for stencil
SPIE Photonics West 2024
Indium Corporation® had the privilege of exhibiting at the world’s premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics, SPIE Photonics
Development of Innovative Advanced Packaging Materials for System in Package
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous
Digital and Physical: Thermal Twins for Developing Thermal Management Solutions
As we all know, finding thermal management solutions is becoming an increasingly critical but also an ever more challenging issue for the semiconductor industry as the power density increases while
Thermal Test Chips (TTCs) for Advanced Semiconductor Packaging
Thermal managementis becoming an ever more critical challenge for semiconductor devices, as the functional density and power density increase – especially with advanced packaging. Thermal test
ML/AI in Semiconductor Packaging and Electronics Manufacturing
As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing. Often, challenges in precision die
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,
Join Me at SMTA PanPac 2024
SMTA PanPac is a unique experience. In addition to the obvious draw of Hawaii in January, the conference tends to host thought leaders in the electronics industry. Along with the expected technical
Adaptive Control: The “Holy Grail” in Semiconductor Smart Manufacturing
Artificial intelligence and machine learning (AI/ML) can havevarious applicationsin smart manufacturing for semiconductor fab, advanced packaging, and electronics manufacturing, and it typically
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