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Folks, About a year ago, I posted on acceleration factors in temperature stress testing. See the equation in Equation 1 below. I made a mistake with the exponent, it should not be 5.5, but 2.65. The

Folks, It is hard to imagine that it has been 15 years since “The Adventures of Patty and the Professor” debuted. It started with a few blog posts and it just kept on going on and on,

Dear Dr. Ron, We are experiencing some graping on BGA solder joints. One of my colleagues said he heard that using square versus our current round stencil apertures might solve the

Folks, Let's see how Ivy Universitygraduate student Maria Gonzales is handling her assignment to find the lost profits a Liberty Elecronics… Maria had never been so nervous. She was going

Folks, Let's see how Professor Patty is doing… Professor Patty Coleman stared out of her office window at the waning remnants of snow on Ivy University’s campus. She was bummed that

Folks, It gives me pause to think that I have lived through most of the electronics revolution. One of my first memories is that my family, along with most others, did not own a

Folks, Can it be almost 20 years ago that I developed the solder alloy density calculator? I have received more requests on this topic than any other. It surprises most people that the formula for

Folks, I remember in 1994 (can it be 30 years ago?) that a colleague commented that in 5 years, wave soldering would go away. Well, 30 years have passed and wave soldering is still with us. Since

Folks, Cp and Cpk assume symmetrical specification limits with respect to the target. However, sometimes specification limits are not symmetrical. As an example, IPC 610 suggests that for stencil

Indium Corporation® had the privilege of exhibiting at the world’s premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics, SPIE Photonics

Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous

As we all know, finding thermal management solutions is becoming an increasingly critical but also an ever more challenging issue for the semiconductor industry as the power density increases while

Thermal managementis becoming an ever more critical challenge for semiconductor devices, as the functional density and power density increase – especially with advanced packaging. Thermal test

As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing. Often, challenges in precision die

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

SMTA PanPac is a unique experience. In addition to the obvious draw of Hawaii in January, the conference tends to host thought leaders in the electronics industry. Along with the expected technical

Artificial intelligence and machine learning (AI/ML) can havevarious applicationsin smart manufacturing for semiconductor fab, advanced packaging, and electronics manufacturing, and it typically

In recent years, silver sinter materials have grown in popularity in power module assembly, especially for die attach. When compared to traditional solders, silver sinter offers numerous benefits

Folks, Let’s look in on Ivy University Professor Patty Coleman as she chats with John Archer about Walter Isaacson’s biography of Elon Musk. “I have to admit, reading about

Typical analyses of low- and mid-temperature solders focuses on improvements to important metrics such as shock resistance and component resilience. What is less known–and even less

Electrification is changing the products and materials that are valued today. Investment in renewable energy is now 1.7x that of fossil fuels, and the utilization of Environment, Social and