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Computing power is surging across high-performance markets like AI, data centers, HPC, and automotive power electronics. As devices push the boundaries of performance, managing heat becomes a

Building Significant Connections What began as a fun side project from my manager, Luanne—interviewing team members to get to know the department—has blossomed into meaningful connections with

My Journey into Applications Engineering In the summer of 2024, I completed an internship in environmental health and safety (EHS) at Indium Corporation, where I spent most of my time in an office

Embracing Growth: My Daily Learning Journey Throughout my STEM internship at Indium Corporation, not a day has gone by that I haven’t learned something new. It’s a bold claim, but I know it’s

My Background and First Impressions I came into this internship with a background in game development, not entirely sure what to expect or how this experience would apply to my career

As a mechanical engineering major and mathematics minor at SUNY Polytechnic Institute, certain company names naturally become familiar over time. One of the most prominent is Indium

In my previous blog post on formic acid soldering, I explained the technology of formic acid reflow soldering, the applications in which it can be beneficial over traditional reflow soldering, the

As the first day of my summer internship at Indium Corporation approached, I had no idea that a personality quiz would become the key to understanding both myself and the team around

Indium oxidation is not merely a surface phenomenon—it plays a critical role in the performance and reliability of high-precision applications, including semiconductors, AI, high-performance

At Indium Corporation, we understand the challenges related to power electronics assembly; devices are increasing in complexity, while demands on performance and reliability grow stronger. On top of

各位，在組裝被動分立元件時，焊錫球的形成問題已存在數十年之久（參見圖 1）。關於「本壘板」式網版開孔設計的發現

In the world of medical device manufacturing, where reliability and precision are critical, materials used in the assembly must meet the highest

在功率模組的封裝貼合焊接應用中，實現高效能、高可靠性及卓越的熱性能至關重要。然而，由於需要較高的回流溫度，

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has surged, highlighting Cu sintering’s suitability for various

With the 4 Nations Face-Off hockey tournament held just recently in Canada and Boston, Massachusetts gained a lot of publicityfor its intensity and high level of play, and arguably pushed the NHL to

In the ever-evolving world of medical technology, quality, precision, and reliability are paramount. When it comes to manufacturing medical devices that can save lives or enhance one’s quality

在 Indium Corporation 擔任技術支援工程師的最初幾週，我進行了廣泛的調查研究，並與團隊商討，以釐清何時應使用助焊劑，以及為何這對……至關重要

Folks, Let's see how Monica and Guy are doing in solving the too-high temperature reflow concern….. Patty was sitting in her office, and, typical to her dynamic personality, was excited and

Folks, Professor Patty Coleman is at it again. Let’s listen in….. Monica Reese was conflicted as she sat at her desk. She was excited that Professor Patty Coleman helped her get a job

Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.

透過 Indium Corporation 的「回收與再利用計畫」，為您的製造流程開創嶄新的效率——這是一項具前瞻性的方案，能將製造後的廢料轉化為寶貴資源。