Blog

Folks, One of the great advantages of being a professor at Dartmouth College is working with the world’s best young students. However, Emily Dean is first my neighbor. I thought readers might

Often with the high focus on void reduction on QFN packages, the focus on the actual volume of solder on the center ground slug and its affect on the signal leads is

As a Manufacturing Process and Quality Engineer for over thirty years, I have seen a great deal of change with fantastic leaps in raw component, assembly, and metrology

Folks, Chris Nash and I (supported by an army of Indium Corporation’s outstanding engineers) wrote a booklet on eliminating solder defects. The title is The Printed Circuit Assembler's

Solder is ubiquitous in internal medical technologies from pacemakers to cochlear prosthetics – the battery, components, and circuit board are held in place by Indium Corporation’s paste,

Applied Power Electronics Conference (APEC) – the leading conference in North America for power electronic professionals – returns to a fully in-person format this year after a year off

Folks, Gold is often used to protect other metals from corrosion. It so effectively resists corrosion that gold is plated over metals like copper when contact resistance is critical, such as in

Folks, When comparing the volume of solder paste provided by a circular versus square aperture, consider that if the side of the square is D and the diameter of the circle is also D, the square has

If I received a dollar for every time I can remember hitting the green in regulation (GIR) on the par 3 Hole #7at the Golf Club of Newport (Newport, NY), in over 15 years of playing the course at

Hi everyone, This past week, Indium Corporation made a triumphant return to IPC’s first in-person APEX event since the onset of the pandemic. Overall, it was a very successful trade show and

Folks, Let’s look in on a graduate student of Ivy University… John Foster felt very fortunate. Not only did he get his undergraduate degree summa cum laude, but was now a graduate student

Folks, I will be presenting three papers at PanPac 2022. They are: 1. Low Melt, High Remelt Solder Paste, co-authored with Claire Hotvedt of Indium Corporation, et al. 2. Derivation of the Shewhart

Folks, In our last post, we discussed techniques to mitigate tin whiskers (TW). To help determine what your tin whisker mitigation strategy should be, consider using failure modes and effects

Folks, In the last post on tin whiskers, we discussed detection. In this post, we will cover mitigation. Since compressive stresses are a primary cause of tin whiskers, minimizing these stresses will

Folks, In the last post on tin whiskers, we discussed detection. In this post, we will cover mitigation. Since compressive stresses are a primary cause of tin whiskers, minimizing these stresses will

Folks, One of the great challenges of tin whiskers is detecting them. When one considers that their median thickness is in the 3 to 5 micron range (a human hair is about 75 microns,) they can be hard

In history, “The Gold Standard” was a monetary system in which countries fixed their currencies to a specified amount of gold. Here at Indium, we also use the phrase, however, to

Folks, I just can back from SMTAI in Minneapolis a few weeks ago. To me it was a big success. One of the reasons being that attendance was higher than I expected. It was also terrific to see so many

Folks, Continuing our series on tin whiskers. In the last post we discussed what they are. in this post we will discuss what causes them. Tin whiskers are primarily caused by compressive stresses in

For any application we need

Folks, A few weeks ago, I posted anSMTquiz on myblogas an opportunity for my readers to test theirSMTIQ. We received 213 responses, which seemed very good to