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能 "熔化 "其他金属的金属

各位金(Au) 保护其他金属免受腐蚀。它的抗腐蚀性能非常出色,因此在金(Au) 电阻至关重要的情况下,例如在

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要证明“零缺陷 ”,唯一的方法缺陷 对所有产品进行抽样检查

朋友们,让我们来看看艾毅大学的一位研究生约翰-福斯特(John Foster)......他感到非常幸运。他不仅以最优异的成绩获得了本科学位,现在还是一名研究生

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锡须 IV:缓解

各位,在上一篇关于锡须的文章中,我们讨论了检测问题。在这篇文章中,我们将介绍如何缓解。由于压应力是产生锡须的主要原因,因此最大限度地减少这些应力将

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锡须 IV:缓解

各位,在上一篇关于锡须的文章中,我们讨论了检测问题。在这篇文章中,我们将介绍如何缓解。由于压应力是产生锡须的主要原因,因此最大限度地减少这些应力将

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锡须 101:第三部分:检测

Folks, One of the great challenges of tin whiskers is detecting them. When one considers that their median thickness is in the 3 to 5 micron range (a human hair is about 75 microns,) they can be hard

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回归基本原理:金基合金

在历史上金(Au) 是一种货币制度,各国将其货币与一定数量的金(Au)挂钩。不过,在Indium,我们也使用这个术语来

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锡须 101:第 2 部分:锡须产生的原因

朋友们,继续我们的锡须系列。在上一篇文章中,我们讨论了什么是锡须,在这一篇文章中,我们将讨论造成锡须的原因。锡须主要是由以下部位的压应力造成的

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Miniaturization in LED Technology: MiniLEDs

大家好,我的团队前几天从《IEEE Spectrum》上看到一篇有趣的文章,其中谈到了最近出现的"......"。

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锡须 101:它们是什么?

朋友们,锡须是锡表面形成的非常细的锡丝或锡须。见图 1。它们是锡中应力释放的结果。锡须是一种现象

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Durafuse™ LT - 过程控制

A low-temperature solder like DurafuseTM LT can be essentialfor many applications where keeping the peak temperature below a certain point is critical (LEDs, flex substrates, opto-electronics, shield

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迈向新能源车“零公里故障”的目标

消除“零公里故障”是电动汽车(新能源车)制造商的座右铭,这自有其道理——消费者对电动汽车抱有极高的期望,他们理所当然地认为

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系统级封装(SiP) 入门网络研讨会预览:焊膏检测

大家好,正如我最近的帖子中所提到的,我即将举办一场关于系统级封装(SiP) 应用焊膏印刷的网络研讨会。与标题所示不同,本次研讨会的内容并不仅限于印刷

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Matching a Reflow Profile to a Solder Paste Spec

Folks, Matching a reflow profile to a solder paste spec is a required skill foran SMT process engineer. In light of this, let’s do an example. Assume we want to start using Indium

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医疗器械中的焊料:等等,那里有焊料?

在上一篇文章中,我谈到了植入式医疗设备(特别是心脏起搏器)中的焊料类型。纯金预型件通常用作心脏起搏器的焊接材料。

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It’s Kind of Fun to Do the Impossible

One of my favorite quotes of all time was said by Walt Disney, and it goes, “it’s kind of fun to do the impossible.” These words have spoken to me throughout most of my college

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The Marcom Field Trip

Growing up, the most exciting days in school were when you were told that you were going on a field trip. About two weeks ago, I received an email from Jingya that she, Angela, and I would be going

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球形格栅阵列常见故障及避免方法

The ball-attach process is admittedly not as exciting as others, such as flip-chip assembly and 2.5D and 3D

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实现目标的新产品

One of my first assignments in graduate school was to read The Goal: A Process of Ongoing Improvement by Eliyahu M.

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A New Running Buddy from Work

This Sunday morning was, for the most part, like any other. I woke up early and enjoyed a warm cup of coffee with breakfast as I read the news and completed a crossword. I then laced up my running

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The Dream Team

In early April, I began to receive emails from two individuals at Indium Corporation; their names were Joy Valencia and Maria Vacca. Little did I know then that they would become two of my closest

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Experiencing The Indium Way

Going into a new job, you never know what to expect. You worry about how you will perform, if the others will like you, and, most importantly, if you will fit in. Of course, these were my exact

在Indium,我们致力于研究、开发和制造先进的电子组装材料 以应对当今、未来以及更长远的挑战。