Indium Blog

Semiconductor Packaging Industry Trends for 2009

  • Ball Attach
  • Die Attach
  • Flux
  • Halogen Free
  • Indium
  • Indium Corporation
  • No Clean Flux
  • Semiconductor Packaging


    A recent interview with Andy Mackie,(Ph.D., Indium Corporation)in Advanced Packaging Magazine helped shed some light on where the semiconductor packaging industry is headed.  Key points of discussion include halogen-free, no-clean ball-attach fluxes, ultra-low residue power die-attach considerations.



    Authored by previous Indium Application Manager Jim Hisert