Indium Corporation’s Dr. HongWen Zhang, R&D Manager, Alloy Group, will share his industry expertise during the IEEE Electronics Packaging Society (EPS) Malaysia Chapter Webinar Series at 9 a.m. Malaysia Time, Wednesday, Dec. 16 (8 p.m. Eastern Time, Tuesday, Dec. 15).

Indium Corporation’s newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSW Automation for use with their newest microfluid dispenser, SD1. 

Indium Corporation’s Joe Hertline, Product Manager – ESM/Power Electronics, will present during a live technical webinar on power electronics for IMAPS on Wednesday, Dec. 9 at 12 p.m. Eastern Time (5 p.m. British Time/1 a.m. Thursday, Dec. 10 Malaysia Time). 

Indium Corporation’s Adam Murling, Technical Support Engineer, will participate in a virtual miniaturization roundtable hosted by BarTron on Thursday, Dec. 10 at 10 a.m. Eastern Time (3 p.m. British Time/11 p.m. Malaysia Time).  

Indium Corporation’s Chris Nash, Product Manager, PCB Assembly Solder Paste, will participate in a Global SMT & Packaging debate on low-temperature solders on Tuesday, December 8 at 10:30 a.m. Eastern Time (3:30 p.m. British Time/11:30 p.m. Malaysia Time). 

Indium Corporation and Valuetronics International have formed a strategic partnership to serve customers in the Americas with its cored wire, rework fluxes, and bar solder products.  

Indium Corporation earned BISinfotech’s BETA Award for Global Innovative Solder Paste Solutions Provider of the Year on Friday, October 30 during a virtual ceremony.

Indium Corporation’s Tim Jensen, Senior Product Manager for Engineered Solder Materials, will present during IMAPS-UK/IEEE-EPS’s online thermal management conference from Nov. 25-26. 

Indium Corporation’s Ross Berntson, President and COO, will be one of the featured speakers at Jobs for the Future (JFF) Horizons virtual conference at 3 p.m. EST (2 p.m. CST), Tuesday, June 9.