Comunicados de imprensa

CLINTON, N.Y., September 1, 2026 — With a team of manufacturing and technical experts supporting customers across India, Indium Corporation will feature its portfolio of high-performance

CLINTON, N.Y., August 31, 2026 — Indium Corporation® Senior Area Technical Manager Luis Pan will discuss how precisely matching materials and assembly processes can positively impact yield and

CLINTON, N.Y., August 28, 2026 — Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges

CLINTON, N.Y., August 24, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and

CLINTON, N.Y., August 21, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging

CLINTON, N.Y., August 20, 2026 – As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability

CLINTON, N.Y., August 11, 2026 — Innovation begins with people and—for the 14th consecutive year—Indium Corporation’s award-winning summer internship program has cultivated the next

CLINTON, N.Y., August 11, 2026 — Indium Corporation, a leading provider of innovative materials solutions for electronics assembly, semiconductor packaging, and thermal management applications,

CLINTON, N.Y., July 30, 2026 — As a leading provider of high-reliability soldering and sintering materials for power electronics devices, Indium Corporation experts will share new research and

CLINTON, N.Y., July 2, 2026 — Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will present research on the use of thermal interface

CLINTON, N.Y., 3 de junho de 2026 — A Indium Corporation® e o Laboratório Nacional de Ames anunciaram uma parceria de investigação e desenvolvimento com o objetivo de expandir a produção norte-americana de gálio, um material essencial utilizado

CLINTON, N.Y., 1 de junho de 2026 — Leo Hu, Gestor Técnico Sénior de Área da Indium Corporation®, irá abordar a forma como os materiais avançados de interface térmica metálica (TIMs) podem atingir novos limites de desempenho em

CLINTON, N.Y., 29 de maio de 2026 – Enquanto líder do setor em soluções inovadoras de materiais para aplicações críticas de RF/micro-ondas, a Indium Corporation® irá destacar os seus produtos de alta fiabilidade à base de ouro

CLINTON, N.Y., May xx, 2026 – As a leading provider of high-reliability materials for all power electronics devices, Indium Corporation® will showcase its AI-enabling portfolio of products at PCIM

CLINTON, N.Y., May 26, 2026 — Indium Corporation®, a leading provider of high-reliability soldering, sintering, and thermal interface materials for power electronics devices, will feature three

CLINTON, N.Y., May 21, 2026 – As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will showcase its high-reliability portfolio of

CLINTON, N.Y., 15 de maio de 2026 — Leo Hu, Gestor Técnico Sénior de Área da Indium Corporation®, irá abordar a forma como os materiais de interface térmica (TIMs) metálicos podem permitir explorar todo o potencial de desempenho de

CLINTON, N.Y., 13 de maio de 2026 — Kyle Aserian, engenheiro de desenvolvimento de aplicações da Indium Corporation® na área de Materiais de Soldadura de Engenharia (ESM), irá apresentar uma investigação sobre a utilização de solda à base de índio

CLINTON, N.Y., May 12, 2026 — As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge

CLINTON, N.Y., May 1, 2026 — As a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product

CLINTON, N.Y., April 30, 2026 — As a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical