Indium Corporation Features InFORMS® Reinforced Solder Ribbon for Automated Assembly at NEPCON Japan 2018
November 16, 2017
Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at NEPCON Japan 2018, Jan. 17-19, in Tokyo, Japan.
Indium Corporation is redefining solder with its patent-pending InFORMS solder ribbon for automated assembly. InFORMS solder ribbon is a composite fabrication consisting of solder and a reinforcing matrix that:
- Increases lateral strength
- Maintains bondline co-planarity
- Improves thermal cycling reliability
For more information about InFORMS, visit www.indium.com/inform or stop to see us at the show at booth #E27-10.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.