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Indium Corporation Features High-Reliability Products for Power Electronics at CIPS

March 4, 2022

Indium Corporation will feature selections from its portfolio of high-reliability solutions for power electronics at the International Conference on Integrated Power Electronics (CIPS), March 15-17 in Berlin, Germany.

Indium Corporation is the leader in power electronics assembly materials as a variety of industries—including automotive, transportation, computing, and energy infrastructure—demand more from power electronics systems. Indium Corporation continues to deliver proven high-reliability material solutions to current and emerging power electronics challenges. 

Indium Corporation’s InFORMS® solder preforms do more than just bond two surfaces—they are designed to address specific challenges for the power electronics industry. InFORMS® are a composite solder material with a reinforcing matrix. This results in:

  • Uniform bondline thickness
  • Improved mechanical and thermal reliability
  • Drop-in alternative to traditional preforms leveraging proven processes

InFORMS® provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand- off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.

For more information, visit Indium Corporation’s experts at the show. 

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit or email Jingya Huang. You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

About CIPS

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization, and high-reliability. Monolithic and hybrid system integration will include advanced device concepts, (e.g. wide bandgap devices, new packaging technologies, and the overall integration of actuators/drives—mechatronic integration).

CIPS is consequently focused on the following main aspects:

  • Assembly and interconnect technology for power electronic devices and converters
  • Integration of hybrid systems and mechatronic systems with high power density
  • Systems’ and components’ operational behavior and reliability

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