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Indium Corporation Introduces New Ball-Attach Flux

May 25, 2021

Indium Corporation continues to expand its flux portfolio with WS-823—a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate. 

While the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process that eliminates the prefluxing step in order to create reliable ball-to-pad joints.  

WS-823 provides:

  • Tackiness suitable for holding solder spheres in place during reflow
  • Excellent solderability on a wide range of surfaces, including AuNi and oxidized Cu-OSP
  • Uniform pin transfer over extended periods, eliminating changes in joint quality over time and uneven deposit sizes, which can lead to "missing ball" 
  • A formula engineered for low-voiding, thereby increasing joint strength 
  • Good cleanability with room temperature DI water, avoiding the formation of white residue

For more information on WS-823, and other materials in Indium Corporation's ball-attach flux porfolio, visit

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit or contact Jingya Huang. You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

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