Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016
February 4, 2016
Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved finished goods reliability. Indium10.1 delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.
For a halogen-free option, Indium8.9HF solder paste delivers very low voiding. Its unique oxidation barrier technology makes it perfectly suited for a variety of applications, especially automotive assembly.
In addition to outstanding print transfer and excellent response-to-pause, Indium10.1 and Indium8.9HF both provide excellent pin-in-paste solderability and hole-fill, while remaining stable at room temperature for up to 30 days.
Avoid the Void means manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs.
Indium10.1 and Indium8.9HF are part of Indium Corporation's family of high-performance, lead-free, low-voiding, no-clean solder pastes. For more information about Indium Corporation's low voiding solder paste, email email@example.com or visit www.indium.com/avoidthevoid.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.