Indium Corporation Features SACm™ at Nepcon South China: New, High-Reliability, Low-Cost SAC Soldering Alloy
July 31, 2013
Indium Corporation will feature its new SACm™ Soldering Alloy at Nepcon South China August 27-29 in Shenzhen, China.
SACm™ is a high-reliability, low-cost soldering alloy that offers drop test performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC soldering alloys.
SACm™ satisfies the electronics assembly market’s demand for a soldering alloy that offers the combination of good drop test performance, good thermal cycling, lead-free composition, and reduced cost.
The invention of SACm™ offers superior drop test performance versus SAC305 and SAC105, with the added benefit of thermal cycling reliability equivalent to SAC305. This provides manufacturers with an affordable high-reliability SAC alloy. This development is especially meaningful for the manufacture of consumer electronics that normally see frequent handling, such as mobile devices.
SACm™ is doped with manganese and contains less silver than other Pb-free alloys. Manganese provides increased strength, and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications.
Additionally, Indium Corporation will feature its Indium8.9 Solder Paste Series, and Solder Fortification® Preforms.
The Indium8.9 series of solder pastes are Pb-free, halogen-free, and designed to eliminate graping, head-in-pillow, and QFN voiding defects. These solder pastes are designed with a robust processing window that minimizes potential defects and accommodates various board sizes and throughput requirements. Indium8.9 provides superior performance characteristics that increase customers’ cost savings, and provides finished goods reliability.
Solder Fortification® Preforms eliminate costly and/or time-consuming processes, such as wave and selective soldering. In addition, they are conveniently packaged in tape & reel for use in existing pick & place equipment. Preforms come in standard shapes, such as squares, rectangles, washers, and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held to tight tolerances to assure volume accuracy.
Indium Corporation will be exhibiting at booth B-1E66.
For more information about Indium Corporation’s SACm™ solder paste, visit www.indium.com/SACm or email SACm@indium.com.