Welcome to Indium Corporation's newsroom. Here you will find Indium Corporation's global communications activities, as well as our recent media interviews.
  Translations:   English

Indium Corporation's Indium8.9HF Solder Paste Series Technology Solution to Avoid the Void®

April 6, 2016

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany.

The Indium8.9HF Series is specifically formulated to Avoid the Void® while delivering high transfer efficiency with low variability.

In addition to outstanding print transfer efficiency and response-to-pause, these no-clean solder pastes also provide a number of other benefits, including excellent pin-in-paste solderability and hole-fill, robust reflow capability, and a wide process window.

The Indium8.9HF Series includes pastes perfectly suited for a variety of applications, especially automotive, due to a unique oxidation barrier technology.

The Indium8.9HF solder paste series is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers to Avoid the Void®. For more information about Indium8.9HF, visit Indium Corporation at stand 7-331, email or visit

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

Back to Newsroom