Engineered Solder and Alloys
Solder is a critical component in the design of most electronic products but it can be easily overlooked. Even the best designed products can fail if proper consideration isn’t given to the solder that will hold it all together. Our soldering experts can help you design a solution at the start of your project that will put your product on the path to success!
Engineered Solders are just that…solders that are engineered for specific applications. There are two main drivers for developing an Engineered Solder: the alloy and the form.
ALLOY: When designing any Engineered Solder, your first consideration should be the temperature. You need to make sure your components and substrate material can withstand the temperatures necessary to reflow the solder. You also need to make sure that the operating temperature of the device will not exceed the reflow temperature. Generally, you will need to reflow the solder at 20-30°C above the liquidus temperature of the alloy. You also need to be aware of any special material exclusions, like Pb, due to RoHS or REACH regulations.
FORM: Next, you need to consider your assembly and reflow processes to determine what form of solder you’ll need. Although our list of alloys is extensive and adaptable, metals have unique properties to take into account when designing the form. Our Applications Engineers have a lot of expertise in this area and can guide you through this process.
For more information choose one of the applications below. Then contact one of our Technical Support team members to begin the process of engineering the perfect solder solution for your application.
Engineered Solder and Alloys Technical Documents
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Product Data Sheets
Safety Data Sheets
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Indium Corporation Blog Posts
New Durafuse™ LT is a novel mixed alloy system designed to combine low temperature reflow with drop-shock performance similar to or better than SAC305.
Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpage and die tilt.
When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-eutectic) and the correct flux for the application are two of these.
From One Engineer to Another®
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