Product Overview
Advanced Materials
Engineers seeking advanced manufacturing solutions should consider integrating supercooled liquid metal pastes into their products. These innovative materials offer enhanced durability, flexibility, and thermal performance—qualities that traditional soldering methods often struggle to achieve due to heat constraints.
No Reflow
Removing heat from electronics manufacturing redefines design capabilities by enhancing miniaturization, enabling the use of desirable substrates and achieving the highest resolution prints.
Improved Yield
Minimizing the time spent in reflow ovens not only boosts volume throughput but also reduces the necessary size of the ovens themselves.
Sustainable
Reducing the temperature and time required in reflow ovens delivers significant energy savings while also reducing carbon emissions.
Related Applications
Related Markets
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