Indium Corporation will feature its void-reducing Indium8.9HF and Indium10.1 Solder Pastes to help customers Avoid the Void® at NEPCON China 2017 from April 25-27, in Shanghai.
Both Indium8.9HF and Indium10.1 deliver excellent response-to-pause printing performance, and remain stable for 30 days at room temperature and up to 12 months when refrigerated. These solder pasts are also equipped with a unique oxidation barrier technology that makes them perfectly suited for a variety of applications, especially automotive assembly.
For more information about Indium Corporation’s low-voiding solder pastes, visit indiumstg.wpenginepowered.com/avoidthevoid.
Per ulteriori informazioni su Indium Corporation, visitate il sitoindiumstg.wpenginepowered.como inviate un’e-mailall’indirizzo [email protected]. Potete inoltre seguire i nostri esperti, From One Engineer ToAnother®(#FOETA), suwww.facebook.com/indiumo su@IndiumCorp.
