Indium Corporations Evan Griffith, product specialist for Semiconductor and Advanced Assembly Materials, will host two webinar sessions about the fundamentals of System-in-Package (SiP) printing as part of the companys webinar program the InSIDER Series.
Griffith will present the same information at both sessions:
- 8 a.m. New York/1 p.m. London/8 p.m. Malaysia on Tuesday, Aug. 24, and
- 5 p.m. San Francisco/8 p.m. New York on Wednesday, Aug. 25, and 8 a.m. Malaysia on Thursday, Aug. 26
Solder paste printing is a complex process with many seemingly minute parameters which could cause defects in a soldered product and, if left untreated, yield losses and cost increases. These defects are especially apparent and can happen quite often when printing for SiP components, which are smaller and have tighter component gaps than those of standard SMT.
In SiP Printing 101, Griffith will outline the basics of fine-feature solder paste printingas well as processes related to and affected by printingand the advancements in printer technology which have simplified the SiP printing process. Griffith will also show data outlining the effects of changing important printing parameters and how Indium Corporation is innovating to meet the challenges of fine-feature printing.
To register for Griffiths webinars, visit https://indium.news/3B8ZEOc. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporations spam filters. This is a first-come, first-served event.
Griffith is a product specialist for SEMI/SAAM fluxes and SiPaste materials. He is based at Indium Corporations global headquarters. He is responsible for researching and analyzing customer and market data, and facilitating current and prospective customers needs. Additionally, he supports customers enquiries, internal product trainings, and works closely with Indium Corporations R&D team on new applications. He earned his Bachelor of Engineering degree in Materials Science, graduating with honors, and his Masters of Engineering Management degree from the Thayer School of Engineering at Dartmouth College, Hanover, N.H., U.S. He has also earned his Six Sigma Green Belt.
Informazioni su Indium Corporation
Indium Corporation è un'azienda leader nella raffinazione, fusione, produzione e fornitura di materiali ai mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti comprendono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Germania, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare www.indium.com o inviare un'e-mail a Jingya Huang. È inoltre possibile seguire i nostri esperti, From One Engineer To Another (#FOETA), all'indirizzo www.linkedin.com/company/indium-corporation/ o @IndiumCorp.
