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Indium Corporation Expert to Present at Automotive Meets Electronics 2019

Indium Corporation expert Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the Automotive Meets Electronics conference from March 12-13 in Westfalenhalle, Dortmund, Germany. 

Vijay will present Innovative Solder Materials for Achieving Highly Reliable Solder Joints. This presentation discusses the importance of strong, high-reliability solder materials due to power electronics' changing requirements for functional reliability, particularly in automotive markets. Vijay also examines how Indium Corporation's InFORMS®technology provides a stable and reliable drop-in solution. 

Vijay is based in the UK and manages Indium Corporation's technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master's degree in Systems Science and Industrial Engineering from Binghamton University, State University of New York.

Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.

For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.