Indium Corporation’s Pony Liao, Area Technical Manager for Northern China, will share his technical expertise at the CEIA Shanghai Seminar on July 19 in Shanghai, China.
Pony’s presentation, How to Achieve High Reliability in Automotive Electronics, will focus on how to address the unique challenges encountered by automotive electronics assemblers. Topics will include materials for achieving high-performance on first yields, electrochemical reliability, voiding, and coating. He will also share the test results of a new high-reliability alloy.
Indium Corporation will also be exhibiting at the seminar. Their booth will feature low-voiding soldering materials for the automotive market, including Indium8.9HF Solder Paste and Indium10.1HF Solder Paste. Technical experts will be available at the booth to answer questions about the presentation and help resolve customers’ assembly challenges.
Liao provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than 10 years of experience in surface mount technology, specializing in defect prevention, quality continuous improvement, and cost reduction. Liao earned his bachelor’s degree from Tianjin University in mechanical and electronics engineering.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
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