Indium Corporation‘s David Socha, technology assessment manager, will present on Indium Corporation’s innovative 3D-EZ-Release build plate, a cutting-edge technology that allows for the quick release of powder bed fusion (PBF) metal printed parts, at the TCT Conference at Formnext at 12:20 p.m. on Friday, Nov. 18 in Frankfort, Germany.
Using Indium Corporation’s novel 3D-EZ-Release build plate, 3D printed metal parts can now be melted off in seconds, revolutionizing the industry by eliminating the need for cutting machinery, such as expensive electrical discharge machining (EDM) wire cutting tools or band saws. These current separation techniques present several problems in additive manufacturing, such as high cost, large footprint, and long process times, resulting in lowered profitability. The 3D-EZ-Release system for PBF metal printing makes the removal of parts fast and simple, and offers lower cost compared to existing processes.
In his presentation, Novel Alloy Build Plate for Quick Release of Metal Parts Printed by Laser Powder Bed Fusion, Socha will present several examples of this new technique. The interaction of the printed metal to the low-melting point alloy will be analyzed and discussed, including an analysis of intermetallics formed at the interface between the alloy and the printed metal part. Cost-of-ownership calculations will also be presented.
Socha is the Technology Assessment Manager for Indium Corporation. His team is responsible for analyzing and investigating emerging markets and technologies that could provide new opportunities for Indium Corporation. He has a bachelor’s degree in applied economics and business management from Cornell University, and a bachelor’s degree in chemistry from the University at Albany. He holds several U.S. patents for solid-state lighting devices (LED) comprising semiconductor nanocrystal complexes.
Informazioni su Indium Corporation
Indium Corporation è un'azienda leader nella raffinazione, fusione, produzione e fornitura di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Germania, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
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