Indium Corporation experts will share their knowledge and insights at two separate Electronic Industries Association of India (ELCINA) events at Productronica India from Sept. 26-28 in Bengaluru, India.
Jonas Sjoberg, Technical Manager, will present Design for Excellence on High-Density Assemblies, at the ELCINA India PCB Tech Conference. Sjoberg’s presentation examines the importance of design when responding to industry miniaturization challenges. He will also touch on advanced materials, process, and equipment concerns to help manage industry needs and customer expectations.
Scott Pringle, Director of Sales, Global Accounts, will lead the special address during the ELCINA CEO Forum Inaugural session and present an Overview of the Global Electronics Industry. He will discuss the global electronics industry from a material provider perspective.
Sjoberg has more than 20 years of technical experience in the electronics assembly industry, including the deployment of leading-edge technologies for packaging and assembly, launching and managing research and development projects and facilities, and serving as a technical advisor to development and manufacturing sites worldwide. He earned his bachelor's degree in electrical engineering from Linköping University, Sweden.
Pringle has been active in the electronics industry for over 35 years. For the past 12 years he has managed the multinational customer business for Indium Corporation and has also been a member of the company’s senior management team. He works with field and inside sales leaders to maintain and cultivate the Indium Corporation’s results-oriented customer support strategy and looks forward to spending more time in India increasing awareness of Indium Corporation’s operations and brand in that region.
Indium Corporation è un’azienda leader nella produzione e fornitura di materiali per i mercati globali dell’elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti; leghe per brasatura; materiali di interfaccia termica; bersagli per sputtering; metalli e composti inorganici a base di indio, gallio, germanio e stagno; e NanoFoil®. Fondata nel 1934, l’azienda dispone di un’assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
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