Indium Corporation will feature its suite of void-reducing, no-clean solder pastes to help customers Avoid the Void® at SMTA International from Oct. 14-18 in Rosemont, Illinois.
Indium Corporation’s suite of solder pastes, including Indium8.9HF and Indium10.1, are specially formulated to deliver ultra low-voiding, plus enhanced benefits such as improved response-to-pause, stability, head-in-pillow (HIP) minimization, reliable in-circuit testing, and enhanced SIR performance.
Indium Corporation’s versatile high-performance solder pastes are designed to accommodate a variety of processing temperatures and industry requirements with lead-free, halogen-free, no-clean options.
For more information about Indium Corporation’s suite of low-voiding solder pastes, visit indiumstg.wpenginepowered.com/avoidthevoid or find us at booth #523.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
