Products Alloys Liquid Alloys

Liquid Alloys

A range of alloys that remain liquid at room temperature.

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  • Liquid at Room Temperature
  • High Thermal Conductivity
  • Non-Toxic, Gallium-Based Materials
A bottle pours a liquid metal into a small metal cup on a gray surface.

Alloys that contain gallium have the intriguing property of remaining in the liquid state at room temperature and below. While pure gallium melts at 30°C, alloying gallium with indium, tin, and/or zinc lowers the melting point even further.

The chart below shows the melting point behavior of alloys that we offer:

Indalloy® 51E is a eutectic composition of 66.5Ga/20.5In/13Sn with a melting point of 11°C

Liquid alloys enable these applications, not only because of their ultra-low melting points, but also because of their additional properties. These alloys can wet to surfaces such as glass and polymers. Gallium also forms an amalgam with most common metals. However, it does not dissolve refractory metals, which have very high melting points.

Liquid gallium rapidly forms a skin of oxidized metal on its surface; this effect is being utilized in many liquid metal technologies. Liquid metals can be utilized in printable solutions and can be embedded in elastomers to act as antennas and sensors. It is also important to note that gallium dissolves aluminum, which precludes its use with heat-sinks made from aluminum, for example.

Alloy/MetalIndalloy® #Ga%In%Sn%Zn%EutecticSolidus (°C)Liquidus (°C)
Ga1410029.8 (MP)29.8 (MP)
Ga/In77955No1525
Ga/In60E7921Yes15.715.7
Ga/In/Sn5162.521.516No1117
Ga/In/Sn51E66.520.513Yes1111
Ga/In/Sn/Zn46L6125131No78

Product Data Sheets

Liquid Metal Gallium and Gallium Alloys PDS 97826 (A4) R10.pdf
Liquid Metal Gallium and Gallium Alloys PDS 97826 R10.pdf
Liquid Metal TIMs PDS 99939 (A4) R2.pdf
Liquid Metal TIMs PDS 99939 R2.pdf

Related Applications

Liquid Alloys are suitable for a variety of applications.

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Flip-Chip

A crucial technique in advanced semiconductor

SiP & Heterogeneous Integration Assembly (HIA)

SiP & Heterogeneous Integration Assembly (HIA)

System-in-package (SiP) and heterogeneous integration solutions

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Fluxless Solutions

Flux-free solder pastes and materials for formic acid

Related Markets

Indium Corporation’s liquid alloys are available for use in a wide range of markets.

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