CLINTON, N.Y., January 9, 2026 — Indium Corporation® will showcase its high-reliability, Au-based precision die-attach preforms for critical laser applications at SPIE Photonics West, January 20-22, in San Francisco, California.
Indium Corporation will feature the following products:
- AuLTRA® DA0001 are precision AuSn die-attach preforms that adhere to the highest level of quality available to deliver the best performance possible in critical, high-reliability laser applications. Key features include:
- Highly accurate thickness control
- Precise edge quality
- Optimized cleanliness
- Standard waffle pack method
- Available for gold-based alloys
- AuLTRA® ThInFORMS® are 0.00035-inch-thick (0.00889mm, or 8.89μm) AuSn preforms that improve the overall operational efficiency of high-output lasers and help combat common issues such as shorting and poor thermal transfer.
- AuLTRA® Fine Ribbon is the company’s AuSn precision ribbon for high-volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and high quality of the ribbon and spooling are of the utmost importance, as are their long, continuous lengths. These features help minimize production downtime and facilitate an efficient, high-throughput process resulting in a high-quality end product with low cost of ownership.
- Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems and offers a sustainable solution attributable to the company’s indium reclaim and recycle program.
- Liquid Metal TIMs are designed to provide superior thermal conductivity for both TIM0 and TIM1 applications. Liquid Metal TIMs offer high thermal conductivity to enhance end-product longevity and reliability, low interfacial resistance against most surfaces to dissipate heat quickly, and exceptional wetting ability to both metallic and nonmetallic surfaces. They are available in a variety of alloys, including InGa and InGaSn.
To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/gold-solder/gold-alloy-preforms/ or stop by show booth #4923.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
