As one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics during Productronica, November 18-21, in Munich, Germany.
Tuesday, November 18
- Novel Solder Alloy Systems Offering High Reliability and Reduced Process Temperatures in PCB Soldering by Senior Technical Manager, Europe, Africa, and the Middle East Karthik Vijay.
- Advancements in solder paste technology, with a specific focus on automotive applications, will be presented. This includes novel mixed alloy systems that offer extended device life cycles through enhanced reliability performance, or energy savings with lower process temperatures compared to industry standard lead-free solders.
Wednesday, November 19
- Materials Technology for Flux-Free Soldering Applications by Product Manager – Semiconductors Dean Payne.
- With the increase in adoption of formic acid reflow techniques in applications such as power electronics, this session will examine best practices for flux-free soldering process development, and materials selection considerations given the current state-of-the art and emerging solder alternatives. Solutions to be reviewed include novel solder paste technology that reduces process steps, cycle times, and improves efficiency in mass production.
Wednesday, November 19
- High Performance Thermal Interface Materials Enabling AI Applications by Senior Product Manager – ESM/Power Electronics Joe Hertline.
- This presentation will examine metal-based, compressible Thermal Interface Materials (TIMs) that offer superior thermal and lifecycle performance compared to traditional organic-based solutions. These attributes are critical to address the thermal dissipation requirements for processor-heavy high-performance computing applications, including AI.
Thursday, November 20
- Emerging Materials Solutions for Top-Side Die Interconnect Applications by Regional Technical Manager and Technologist for Advanced Applications Andreas Karch.
- As power devices trend toward reduced size and higher output seeking better efficiency, this session will highlight new materials solutions offering robust performance, including Copper Sintering, reinforced solder preforms, and reliability-enhancing alloy technologies.
About the Presenters
Joseph Hertline is responsible for driving the growth of the power electronics product line by developing and implementing marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation’s sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market.
Andreas Karch provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. His expertise includes solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of experience in automotive and power electronics, including developing advanced customized solutions.
Dean Payne is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. Payne collaborates with internal departments, including sales, technical service, R&D, production, and quality, providing support for all semiconductor and advanced assembly materials.
Karthik Vijay is responsible for technology programs and technical support for customers in Europe, Africa, and the Middle East. His expertise is in automotive, industrial, and RF applications involving PCBA and power electronics with a focus on the use of different material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials.
To learn more about Indium Corporation’s solutions for power electronics and e-Mobility, be sure to visit our experts at Productronica in Hall A4, Stand 309.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
