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Indium Corporation Launches New Solder Paste for High Print Consistency and Easy Cleanability

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of SiPaste® C312HF, a halogen-free, cleanable solder paste formulated for fine-feature printing. Designed with Type 7 powder for aperture sizes down to 60μm, it enables fine-feature printing in advanced system-in-package applications.

SiPaste® C312HF boosts process yields that combine best-in-class stencil print transfer efficiency and excellent stencil life with consistent printing, excellent response-to-pause, and superior reflow performance. SiPaste® C312HF post-reflow flux residue can be cleaned with a standard cleaning process using semi-aqueous chemistries or a saponifier, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not required.

SiPaste® C312HF delivers several benefits to users, including:

  • Consistent with low standard deviation solder deposit spread across multiple prints
  • Outstanding slump resistance
  • Low voiding across all components
  • Optimized powder formulation and flux vehicle
  • Requires minimal stencil cleaning during printing
  • Wide reflow profile window
  • Excellent wetting capability on various metallization

Indium Corporation’s SiPaste® series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 8, including the SiPaste® C312HF with Type 7 powder. The products help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance.

To learn more about Indium Corporation’s semiconductor solder pastes, visit https://www.indium.com/products/solder-paste/semiconductor/.    

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.